Type | Ingredient (WT%) | Melting point (ºC) | Application scenario |
Tin-Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
Sn62.6Pb37Ag0.4 | 183-190 |
Sn60Pb40 | 183-203 |
Sn55Pb45 | 183-215 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding |
Sn50Pb50 | 183-227 |
Sn45Pb55 | 183-238 |
Lead-free solder paste | Sn99Ag0.3Cu0.7 | 183-248 | Low cost, high melting point. Can be used for less demanding welding |
Sn96.5Ag3.0Cu0.5 | 183-258 | High cost, good performance, suitable for high-demand welding |
Sn64.7Ag0.3Bi35 | 183-266 | Good performance, low melting point, and finer lattice alloys |
Sn64Ag1.0Bi35 | 183-279 | High cost, good performance, commonly used lead-free solder |
Sn42Bi58 | 227 | Prevent corrosion by CU, suitable for low temperature welding |