Complaint
Features:
1) A variety of specifications available.
2) Satisfy various technical request
3) Lower medium spoilage
4) Good insulation performance and high temperature resistance
5) Stiffness texture
6) Low thermal conductivity
7) Used in all electric products and electric heating products
Alumina Ceramic Thin Plate are the main products of our company and sales all over the world are very good.
Mission ceramic provide high quality alumina ceramic products.
Our substrate are widely used for direct bond copper substrate (DBC), printer, LED and other high power circuit substrates and heat emission substrates of electronic components.
We can make any thickness as you need from 0.25 to 1.2mm. Max length we can provide is 280mm.
Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.
Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm
Data Sheet :
| Material | 85 Al2o3 | 90 Al2o3 | 95 Al2o3 | 99 Al2o3 |
| Al2o3 | 85% | 90% | 95% | 99.3% |
| Fe2o3 | ≤ 1.0 | ≤ 0.5 | ≤ 0.5 | ≤ 0.3 |
| Desnsity: g / cm3 | 3.4 | 3.5 | 3.6 | 3.85 |
| Vickers Hardness | ≥ 8.6 | ≥ 8.8 | 9 | 9 |
| Water Absorption:% | ≤ 0.2 | ≤ 0.1 | ≤ 0.085 | ≤ 0.01 |
| Refractoriness:°C | 1580 °C | 1600 °C | 1580 °C | 1580 °C |
| Flexural Strength:Mpa | 180 | 200 | 240 | 280 |
Wear Rate( at room temperature, erosion, 100 grinding)% | ≤ 3 | ≤ 2.5 | ≤ 1 | ≤ 0.5 |
| Test Items | Technical Parameters | Test Conditions |
| Printing layer/Coating graphic | Keep in conformity with the product drawing | 10 x microscope |
| Printing layer/Coating thickness | Keep in conformity with the product drawing | X ray fluorescence thickness gauge |
| Drying-out resistance | No defects on printing layer/ coating surface such as blisters, discolor, peeling | Heating on heating board 300ºC/5min |
| Solder invasive | Invasive area≥95% | 260±5ºC/5±1 Sec immersion tin |
| Soldering resistance | Unilateral adhered tin 75μm | 260±5ºC/10±1 Sec immersion tin |
| Tension | Printing layer >20gf | Welding plate crossed φ130μm Cu |
| Adhesion | Not stripping | Tape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec |
2:Application:
1.The Plate Is Mainly Used In High-Density Hybrid Circuits,Microwave Power
Devices, Power Semiconductor Devices,Power Electronic Devices,
Optoelectronic Components,Semiconductor Refrigeration Products Such As
Substrates For High-Performance Materials And Packaging Materials
5:What can we do for you?
1. Sample is available.
2. Independent R&D, ISO manufacture, precise quality standards, modern logistics management, and sound marketing strategy.
3. Inquiry replied within 24 hours.
4. Patented products.
5. OEM or ODM is available.
6. Some extra accessories can be supplied.
7.The larger quantity you order,the more competitive prices you'll get.
8. Necessary Certificates can be supplied.
9:Why To Choose Us
1. Low MOQ:
It won't occupy too much of your money to help you to test the market you're going to enter.
2. R & D Center and Factory:
We have our own R & D center and factory, so we can supply you products at competitive price.
3. Good Service :
We treat clients as friends.
4. Good Quality :
We import top quality accessories to manufacture our products, we have confident we can offer you the best quality.
5. After-sales service:
One year's guarantee. Wearing accessories comes with the products to help you to reduce the repair bill.
