Complaint
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
Rigid PCB Manufacturing Capacity
ABIS experienced in making special materials for rigid PCB, such as: CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. Below is a brief overview FYI.
Item | Speci. |
Layers | 1~20 |
Board Thickness | 0.1mm-8.0mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc |
Max Panel Size | 600mm×1200mm |
Min Hole Size | 0.1mm |
Min Line Width/Space | 3mil(0.075mm) |
Board Outline Tolerance | +_0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 0.10mm--6.30mm |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 16:1 |
Solder Mask Type | LPI |
SMT Mini. Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance Control Tolerance | +_10% |
Surface finish | ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold |
Soldermask | Green/Yellow/Black/White/Red/Blue |
Silkscreen | Red/Yellow/Black/White |
Certificate | UL, ISO 9001, ISO14001, IATF16949 |
Special Request | Blind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half holes |
Material Suppilers | Shengyi, ITEQ, Taiyo, etc. |
Common Package | Vacuum+Carton |
PCB Lead Time
| Category | Q/T Lead time | Standard Lead Time | Mass Production | |||
| Double Sided | 24hrs | 3-4 working days | 8-15 working days | |||
| 4 Layers | 48hrs | 3-5 working days | 10-15 working days | |||
| 6 Layers | 72hrs | 3-6 working days | 10-15 working days | |||
| 8 Layers | 96hrs | 3-7 working days | 14-18 working days | |||
| 10 Layers | 120hrs | 3-8 working days | 14-18 working days | |||
| 12 Layers | 120hrs | 3-9 working days | 20-26 working days | |||
| 14 Layers | 144hrs | 3-10 working days | 20-26 working days | |||
| 16-20 Layers | Depends on the specific requirements | |||||
| 20+ Layers | Depends on the specific requirements | |||||
Quality Control
-Advanced equipment list
| AOI Testing | Checks for solder paste Checks for components down to 0201 Checks for missing components, offset, incorrect parts, polarity |
| X-Ray Inspection | X-Ray provides high-resolution inspection of: BGAs/Micro BGAs/Chip scale packages /Bare boards |
| In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
| Power-up Test | Advanced Function Test Flash Device Programming Functional testing |
-Persue 0% complaint on quality
WELCOME TO ABIS CIRCUITS CO., LTD
Production line
ABIS GROUP is a professional PCB manufacturing which is focused on double side, Multilayer and HDI PCB mass production. The company was established in 2006, We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Huizhou is for big volume and HDI.
| Shenzhen | jiangxi | |
| Area | 10,000 Square meters | 60000 Square meters |
| Employees | 300 | 900 |
| Quality | 20 | 60 |
Administration | 5 | 10 |
| Engnieering | 20 | 90 |
Over Sales | 10 | 20 |
| Item | Capacity |
| Raw material | Aluminum base, Cooper base |
| Layer | 1-8 Layer |
| Min.Line width/space | 4mil/4mil(0.1mm/0.1mm) |
| Min.hole size | 12mil(0.3mm) |
| Max. Board size | 1200mm*560mm(47in*22in) |
| Finished board thickness | 0.3-5mm |
| Cooper foil thickness | 35um-210um(1OZ-6OZ) |
| Remain thickness tolerance | +/-0.1mm |
| Hole position tolerance | +/-0.05mm |
| Routing outline tolerance | +/-0.15mm |
| Punching outline tolerance | +/-0.1mm |
| Surface finished | Lead-free HASL, Immersion gold, immersion silver, OSP, etc |
| MC PCB Production capability | 10,000 a.q.m/month |
| Item | Capacity |
| Raw material | CEM1, CEM3, FR1 FR4, Rogers, Teflon, etc. |
| Layer | 1 Layer-20 Layer |
| Min.Line width/space | 3mil/ 3mil (0.075mm/0.075mm) |
| Min.hole size | 0.1mm(drilling hole) |
| Max. Board size | 1200mm* 600mm |
| Finished board thickness | 0.2mm-6.0mm |
| Cooper foil thickness | 18um- 280um (0.5oz-8oz) |
| NPTH Hole Tolerance | +/- 0.075mm |
| PTH hole Tolerance | +/-0.05mm |
| Outline tolerance | +/-0.13mm |
| Surface finished | Lead-Free HASL, immersion gold(ENIG), Immersion silver, OSP, gold plating, gold finger, Carbon INK |
| Impedance Control Tolerance | +/-10% |
| Production capability | 50,000 s.q.m/ month |
ABIS CIRCUITS Company is not only trying to give customers a good product, but also pay attention to offering a complete and safe package. Also, we prepare some personalized services for all the orders.
-Common packaging:
-Delivery Tips:
Business Terms
-Accepted Delivery Terms
FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF
--Accepted Payment Currency
USD, EUR, CNY.
-Accepted Payment Type
T/T, PayPal, Western Union.
Quotation from ABIS
To ensure an accurate quote, be sure to include the following information for your project:
FAQ
