Item | Production Capacity |
Layer Counts | 1-20 layers |
Material | FR-4(High TG),Aluminum Base,Cu base,CEM1,CEM3,Polyimide,Halogen free,Rogers |
Board thickness | 0.20mm-8.00mm |
Maximum Size | 600mmX1200mm |
Board Outline Tolerance | +0.10mm |
Thickness Tolerance(t≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm)<> | ±10% |
Insulation Layer Thickness | 0.075mm--5.00mm |
Minimum Line | 0.075mm |
Minimum Space | 0.075mm |
Out Layer Copper Thickness | 18um--350um |
Inner Layer Copper Thickness | 17um--175um |
Drilling Hole(Mechanical) | 0.15mm--6.35mm |
Finish Hole(Mechanical) | 0.10mm-6.30mm |
Diameter Tolerance(Mechanical) | 0.05mm |
Registration(Mechanical) | 0.075mm |
Aspect Ratio | 16:1 |
Solder Mask Type | LPI |
SMT Mini.Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance control Tolerance | ±10% |
Surface finish/treatment | HASL-LF,ENIG,Hard gold plating,Immersion Tin/Silver,Flash Gold, OSP, Gold Finger,Peelable mask etc |