Complaint
| PCB Assembly Capability | |
| Order Quantity | 1-50,000pcs(including prototype) |
| Components | SMD and THT From size 0402.0201 to 01005 SOIC,PLCC,TSOP,QFP,BGA |
| Assembly Method | Single and double-sided/SMD and THT/SMT and Thru-hole |
| Ball Grid Array(BGA) | As small as 0.5mm pitch All BGA placements are inspected by X-Ray |
| Components Package | Poles,Reels,Tape Strips,Bulk Supply |
| Maximum Componentsize | 55*55*15mm Fine Pitch from 0.4mm Minimum Pin width 0.2mm |
| Solder | Lead free and conforming to DIN 32513,ISO,EN29454,IPC 650 |
| Related Test | Aol & X-Ray Inspection,Flying Probe Test and in Circuit Test |
| File Format | BOM & Gerber files |
Our service
| Inquiry | 1. Please send the BOM list and PCB Gerber files to us for detail quotation |
| 2. If you need to design, please provide us the schematic, functions of product, size etc. Sample and Picture would be better. | |
| Quotation | 1. Engineer confirms PCB requirements and Purchasing department confirms components. |
| 2. Quotation will be offered within 3 working days. | |
| Payment | Regarding payment term: T/T, L/C. |
| Sample making | Few samples will be produced before full production; All steps are strictly performed by company control and quality control. |
| Mass Production | After sample confirmed discussion about packing, shipping. Production department start the order schedule. |
Our quality
