Description
1. Feature:a. 355nm UV wave band and cold light source;
b. Narrow pulse width and high peak power;
c. It is most suitable for sensitive material marking processing work;
d. Air cooled maintenance-free design, which is long working life;
e. Excellent beam quality is suitable for all types of fine marking;
f. The laser acts directly on the molecular chain of the material which is maximum avoidance of heat effect.
2. Advantage:Due to the extremely small focus spot and the small processing heat-affected zone, the UV laser can perform ultra-fine marking and special material marking.
It is the first choice for customers who have higher requirements for marking effects. In addition to copper materials, UV lasers are suitable for processing a wider range of materials. Not only the beam quality is good, the focused spot is smaller, and ultra-fine marking can be achieved; the scope of application is wider; the heat-affected area is extremely small, no heat effect, no material burning problem; fast marking speed, high efficiency; overall performance Stability, small size, low power consumption and other advantages.
Benefits of the UV Laser Marking MachineHigh Precision mark focused spot is smaller, and ultra-fine marking can be achieved; the scope of application is wider; the heat-affected area is extremely small, no heat effect, no material burning problem; fast marking speed, high efficiency; overall performance Stability, small size, low power consumption and other advantages. | |
| Easy to be operated The original laser marking machine software EZCAD acts like a printer software. Users can design their graphics freely. Common types of images and vector images are supported. (BMP, JPG, GIF, TGA, PNG, TIF, AI, DXF, DST, PLT.) It support the computer environment 32 bits and 64 bits.
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3. Main Structure4. Application:The UV laser marking machine adopts the top 355nm UV laser wave band processing industry.
The 355nm UV laser wave band is applied to fine marking, fine cutting and micro processing for special materials.
It can reduce the influence of deformation and heat effect of processing materials to the greatest extent. It is mainly used in various glass, liquid crystal screen, textile, thin ceramic, semiconductor silicon, and IC grain, sapphire, polymer film and etc.5. Case:Marking of packaging surfaces for cosmetics, pharmaceuticals, food, and other polymer materials; marking and scribing of flexible PCB;
Microwaving of silicon wafers;
Mark the metal surfaces, plastic buttons, plastics (PC, PVC, PE, etc.)
Ultra precise mark the electronic components, household appliances, gifts, communication equipment, and building materials.
Cosmetic | Glass Cup | PCB Board | Power shell |
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Diamond | Ceramics | Plastic Button | Power Indicator |
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6. Main Components6.1 Laser Source: JPT/ HUARAY/ INNGU
6.2 Galvanometer Scanner: SINO-GALVO
6.3 Field Lens: WAVELENGTH
6.4 Marking Card/ Power Supply: BJJCZ/ MEAN WELL
6.5 Rotary Device (If need)
7. Contact Information
To be continued..