Complaint
| Light Chip | |||
| Type | SMD1010 | Chip parameters | Red λd:(620-625nm) IV:(800-960mcd) |
| Color | 1R1G1B | Chip parameters | Green λd:(520-525nm) IV:(1350-1650mcd) |
| Brand | Nationstar | Chip parameters | Blue λd:(470-475nm) IV:(330-400mcd) |
| LED Module | |||
| Pixel Pixel | 1.25 mm | Module Size | 150 mmWX56.25 mmH |
| Module Resolution | 120x45=5400(Dots) | Module Weight | 0.2kg |
| LED Display Cabinet | |||
| Pixel Density | 640000Dots/m2 | Frame Frequency | no less than 60 frame/sec |
| Cabinet Resolution | 480×270=129600(Dots) | Input Voltage | AC110-220V±10%,50/60Hz |
| abinet Dimension(W*H*D) | 600x 337.5 x 75mm | Output Voltage | DC-5V,40A/60A/80A |
| Module Quanty /Cabinet | 8 pcs = 2(w) x 4(h) | Grey Scale Levels | 14bit |
| Cabinets Material | Die-casting Alminum Cabinet | Color Processing | R(1024)×G(1024)×B(1024) |
| Cabinet Weight | 7.3 kg | Brightness Adjustment | 256 color levels |
| Brightness | ≥50 - 600 nits | MTBF( mean time between failures) | 5000 hours |
| Viewing Angle | Horizontal 170°, Vertical 170° | Life-span | 100,000 hours |
| Nearest Viewing Distance | 2 meter | Protection Level(front/back) | IP45 |
| Power Consumption (Max) | 800 w/m2 | Malfunction Dot Rate | less than 0.0001 |
| Power Consumption (Average) | 300 w/m2 | Working Temperature | -30ºC~50ºC |
| Display Function | Text,Graphics,Video | Humidity | 15%~85% |
| Refresh Rate | ≥2000Hz | Scan Mode | 1/45 |
| Control System | |||
| Control Mode | Synchronization/Asynchronization | Control System | Sending Card, Receiving Card,Receiving HUB |
| PC Operating System | Microsoft Windows 7, XP and Vista | Software | ED Studio Nova/Linsin |
| Communication Type | Net cable,3G,WIFI(Sold separately) | Control Card Input | DVI,USB,RJ45,HDMI(Sold separately) |
| Language | Chinese,Traditional Chinese,English,French,Japanese,Russian, Thai,Spanish,Polish,Italian,Portuguese,Turkish,Dutch,Greek,Bulgarian, Romanian,Arabic | ||
What is COB Package technology?
COB package is called Chips on Board (COB), which is a technology to solve the problem of LED heat dissipation. Compared with in-line and SMD, it is characterized by saving space, simplifying packaging operations, and has an efficient thermal management method.
The COB package is chip on board, which is to stick the bare chip on the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to achieve its electrical connection. If the bare chip is directly exposed to the air, it is susceptible to pollution or artificial damage, which affects or destroys the function of the chip, so the chip and the bonding wire are encapsulated with glue. People also call this form of packaging soft package.
Packing: Anti-shaking wooden cabinet/Air flight case/strong carton
Shipping port: Shenzhen, China
Shipping way:Air;Express;Ocean;Land Transportation
Delivery time: 7-15 working days after confirm receipt payment in advance.
Long working life: In the Maintenance period, free of all maintenance charge.After maintenance period only charge the material costs fees.
A: Yes, we welcome sample order to test and check quality. Both for LED moduel or
a whole screen.
A:About 7~10 working days.
A: Low MOQ, 1 square meter or a moudle checking is available
A: We mostly accectp FOB train term, but we can help you order and arrange shipping agent.
It usually take 20 30 day on sea. a few days for customer clearance
A: Firstly let us know your requirements or application.
Secondly We quote according to your requirements or our suggestions.
Thirdly customer confirms the design document and places deposit for formal order.
Fourthly We arrange the production.
A: Yes, we offer 2 years warranty to our products.
A: Our products are produced in strict quality control system and the defective rate will be less
than 0.2%.
