Material | Wt% Molybdenum Content | Wt% Copper Content | g/ Density at 20ºC | W/M.K Thermal conductivity at 25ºC | (/k) Coefficient of thermal expansion at 20ºC |
Mo85Cu15 | 851 | Balance | 10 | 160-180 | 6.8 |
Mo80Cu20 | 801 | Balance | 9.9 | 170-190 | 7.7 |
Mo70Cu30 | 701 | Balance | 9.8 | 180-200 | 9.1 |
Mo60Cu40 | 601 | Balance | 9.66 | 210-250 | 10.3 |
Mo50Cu50 | 500.2 | Balance | 9.54 | 230-270 | 11.5 |
Material | g/ Density at 20ºC | (10-6/k) Coefficient of thermal expansion at 20ºC | W/M.K Thermal conductivity at 25ºC | ||
In-plane | Thru-thickness | In-plane | Thru-thickness | ||
1:4:1 | 9.4 | 7.2 | 9.0 | 340 | 300 |
Thickness (mm) | Width(mm) | Length(mm) | Surface | Rolled condition | |
Molybdenum Plate | 8.0-16.0 | 10-1000 | 10-1000 | Alkali washed | Hot rolled |
3.0-8.0 | 10-1000 | 10-1000 | Hot rolled | ||
Molybdenum sheet | 1.5-3.0 | 10-1000 | 10-2500 | Acid cleaning | Coled rolled |
0.5-1.5 | 10-1000 | 10-2500 | Cold rolled | ||
0.2-0.5 | 10-1000 | 10-2500 | Cold rolled |