Complaint
| Product Parameters | |
| Alloy | Sn55Pb45 |
| weight | 500g |
| Melting point | 202ºC |
| Flux | 1.8%/2.0%/2.2%/2.4%/2.6%/3.0% |
| wire diamete | 0.5/0.6/0.8/1.0/1.2/1.5/2.0/3.0mm |
| Package | 50g/100g/200g/500g/600g/700g/750g/800g/900g/1000g |
| Product Specification | |||
| Type | Ingredient (WT%) | Melting point(ºC) | Application scenario |
leaded tin wire | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
| Sn60Pb40 | 190 | ||
| Sn55Pb45 | 200 | ||
| Sn50Pb50 | 212 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
| Sn45Pb55 | 227 | ||
| Sn40Pb60 | 247 | ||
| Sn35Pb65 | 247 | Suitable for relatively low requirements of the circuit board, such as: hardware equipment, automotive water tank lighting bulbs, cable connectors and other products welding | |
| Sn30Pb70 | 257 | ||
| Sn25Pb75 | 268 | ||
| Sn20Pb80 | 280 | ||
Lead-free tin wiree | Sn96.5Ag3.0Cu0.5 | 217 | Applicable to high-end electronic products, export quality of electronic, electrical industrial products |
| Sn99Ag0.3Cu0.7 | 227 | ||
| Sn99.7Ag0.3 | 227 | ||
| Sn99.95 | 227 | Applicable to all kinds of circuit board plating and used in tin furnaces with excessive copper to reduce copper content | |
| Sn42Bi58 | 138 | Thermal fuses for thermal fuses, thermal protectors, thermal fuses | |
