PCBA Technical Capability | |
1. Assembly Type:: | FR4, FPC, Rigid-flex PCB, Metal base PCB. |
2. Assembly Specification: | Min size L50*W50mm; Max size: L510*460mm |
3. Assembly thickness: | Min thickness: 0.2mm; Max thickness: 3.0mm |
4. Components Specification | |
Components DIP: | 01005Chip/0.35 Pitch BGA |
Minimum device accuracy: | +/-0.04mm |
Minimum footprint distance: | 0.3mm |
5. File format: | BOM list; PCB Gerber file: |
6. Test | |
IQC: | Incoming inspection |
IPQC: | Production inspection; first ICR test |
Visual QC: | Regularly quality inspection |
SPI test : | Automatic solder paste optical inspection |
AOI: | SMD component welding detection, components shortage & component polarity detection |
X-Ravd: | BGA test; QFN and other precision devices hidden PAD device inspection |
Function test: | Test function and performance according to the customer's test procedures and steps |
7. Reworking: | BGA rework equipment |
8. Delivery Time | |
Normal delivery time: | 24 hours( fastest 12 hours quick-turn) |
Small production: | 72 hours( fastest 24 hours quick-turn) |
Medium production: | 5 working days. |
9. Capacity: | SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day |
10. Components Service | |
A full set of substitute materials: | Have experience in component procurement sourcing, and management system, and provide cost-effective services for OEM projects |
Only SMT: | Do SMT and backhand welding according to components PCB boards provided by customers. |
Components purchasing: | Customers provide core components, and we provide component sourcing services. |
PCBA Technical Capability | |
1. Assembly Type:: | FR4, FPC, Rigid-flex PCB, Metal base PCB. |
2. Assembly Specification: | Min size L50*W50mm; Max size: L510*460mm |
3. Assembly thickness: | Min thickness: 0.2mm; Max thickness: 3.0mm |
4. Components Specification | |
Components DIP: | 01005Chip/0.35 Pitch BGA |
Minimum device accuracy: | +/-0.04mm |
Minimum footprint distance: | 0.3mm |
5. File format: | BOM list; PCB Gerber file: |
6. Test | |
IQC: | Incoming inspection |
IPQC: | Production inspection; first ICR test |
Visual QC: | Regularly quality inspection |
SPI test : | Automatic solder paste optical inspection |
AOI: | SMD component welding detection, components shortage & component polarity detection |
X-Ravd: | BGA test; QFN and other precision devices hidden PAD device inspection |
Function test: | Test function and performance according to the customer's test procedures and steps |
7. Reworking: | BGA rework equipment |
8. Delivery Time | |
Normal delivery time: | 24 hours( fastest 12 hours quick-turn) |
Small production: | 72 hours( fastest 24 hours quick-turn) |
Medium production: | 5 working days. |
9. Capacity: | SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day |
10. Components Service | |
A full set of substitute materials: | Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects |
Only SMT: | Do SMT and backhand welding according to components PCB boards provided by customers. |
Components purchasing: | Customers provide core components, and we provide component sourcing services. |