Pct High Pressure Accelerated Aging Test machine for Semi Conductor Reliability Testing

Min.Order: 1
Product origin: Dongguan, Guangdong, China
Infringement complaint: complaintComplaint
US$ 20000 ~ 35000

Description

PCT High Pressure Accelerated Aging Test Mahcine for Semi Conductor Reliability Testing

Product description

The purpose of the Highly Accelerated Aging Test (HAST) is to increase product environmental stress (such as temperature) and working stress (voltage, load, etc. applied to the product), speed up the test process, and shorten the life test time of the product or system. , The reliability of semiconductor products has improved. At present, most electronic devices can withstand long-term high temperature and high humidity deviation tests without failure. Therefore, the test time used to determine the quality of the finished product has also increased a lot. In the design stage of the product, it is used to quickly expose the defects and weaknesses of the product, and test the sealing and aging performance of its products.

Volume and dimension

VolumeAbout 55L
Interior sizeØ550 mm*D650mm(Drum type pressure inner box)
  Exterior sizeW900 mm*H1552mm*D1500 mm(Excluding the protruding part of the machine!)
Tips: For external dimensions, please confirm the three views according to the final design!

The main technical parameters

 Test ConditionsCool method: :Natural cooling or air purging
Measured at a room temperature of +25 ºC under no load, Measured at normal pressure 101.3Kpa, the temperature and humidity performance test is measured according to the relevant regulations according to GB/T 2424.5 or IEC60068 -3; the sensor is placed at the air outlet of the air handling unit.
 Temperature range+105ºC~+135ºC(At 100% relative humidity)
Temp.  fluctuation±0.5ºC
Temp. uniformity≤±3.0ºC
Temp. deviation≤±3.0ºC
  Humidity range1) HUM unsaturated test mode: 65~100%RH
2) STD saturation test mode: 100%RH
 Humidity Fluctuation ±3.0%RH
 Humidity Deviation±5.0%RH
 Temperature change rateHeat up rate:
 +25ºC~+135ºC, full range average speed  approx 45 min (no-load,no heating)
Loadno
 Note:Measured at a room temperature of +25 ºC under no load,the temperature and humidity performance test is measured according to the relevant regulations according to GB/T 2424.5 or IEC60068 -3; the sensor is placed at the air outlet of the air handling unit.
  Pressure rangeGauge pressure: +0.2 ~ 200Kpa
*Absolute pressure: 100 ~ 300Kpa
  Pressure deviation≤±2 kPa
  Pressure rise timeAtmospheric pressure to 200Kpa   20min

Features:
The industry's first application of fluid simulation design technology and product process manufacturing technology, the product is more energy-efficient.
The inner tank adopts a double-layer arc design, which can prevent the phenomenon of condensation and dripping in the test, so as to avoid the direct impact of the superheated steam on the product in the test process and affect the test result.
Fully automatic water replenishment function, front-mounted water level confirmation.
(Attached table)

Test conditionsTemperatureHumidityDurationRemark
JEDE-22-A102121ºC100%R.H.168hOther duration:
24h, 48h, 96h, 168h, 240h, 336h
IPC-FC-241B-PCB tensile strength test of copper laminate 121ºC100%R.H.100hCopper laminate strength: 1000N/m
IC auto clave testing121ºC100%R.H.288h 
Low dielectric high heat resistance multilayer board121ºC100%R.H.192h 
PCB plugging agent121ºC100%R.H.192h 
PCB-PCT test121ºC100%R.H.30minLamination, bubble, white dot
Lead free soldering accelerated aging test 1121ºC100%R.H.8hEquivalent to 6 months high temp high humidity, activation energy: 4.44ev
Lead free soldering accelerated aging test 2121ºC100%R.H.16hEquivalent to 12 months high temp high humidity, activation energy: 4.44ev
IC lead free aging test121ºC100%R.H.1000hCheck at every 500h
Flat panel tightness test121ºC100%R.H.12h 
Metallic gasket121ºC100%R.H.24h 
IC packaging test121ºC100%R.H.500h, 1000h 
PCB moisture absorb test121ºC100%R.H.5h, 8h 
FPC moisture absorb test121ºC100%R.H.192h 
PCB plugging agent121ºC100%R.H.192h 
Low dielectric high heat resistance multilayer material121ºC100%R.H.5hWater absorption less than 0.4-0.6%
High Tg glass epoxy multilayer PCB material121ºC100%R.H.5hWater absorption less than 0.55-0.65%
High Tg glass epoxy multilayer PCB material
Heat resistance of reflow welding after moisture absorption
121ºC100%R.H.3h 
Co-bra Bond121ºC100%R.H.168h 
Automotive PCB121ºC100%R.H.50h, 100h 
Mainboard PCB121ºC100%R.H.30min 
GBA board121ºC100%R.H.24h 
IC accelerated moisture resistance test121ºC100%R.H.8h 


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