Table 1 | |||
Conductor material | T2 copper, 1060AL, copper clad aluminum (optional) | Maximum number of busbar layers | 6 layers |
Insulation withstand voltage | 300V-20KV | Working temperature | -40~105ºC |
Rated current | 0-4000A | Maximum withstand voltage range | 1000~20KV |
Device connection method | copper plate embossing, copper pillar riveting, copper pillar welding(optional) | Sample lead time | 2 weeks to 3 weeks |
Conductor surface treatment | passivation, tin plating, nickel plating, silver plating, conductive oxide(optional) | layer adhesion | >1300N (split strength) |
Insulation material | NOMEX,polyimide PI,Polyvinyl fluoride PVF,PET,FR4(optional detail in table 2) | partial discharge | <10PC |
Flame retardant rating | UL 94V-0 | Parasitic inductance | 15nH/m |
Insulation resistance | 20MΩ DC/1000V | Production capacity | 20000 pieces/month |
Temperature rise | <30K | Maximum processing size | 1800*1000mm |
Table 2(Insulation material parameters) | ||||||||
Density (g/cm3) | Thermal expansion coefficient | Thermal conductivity W (kg.K) | Dielectric constant (f=60Hz) | Dielectric strength (kV/mm) | Flame retardant grade | Insulation heat resistance grade | Water absorption (%)/24h | |
NOMEX | 0.8~1.1 | 0.143 | 1.2 | 9 | 94 V-0 | 220 | ||
polyimide PI | 1.42 | 20 | 0.094 | 3.7 | 9 | 94 V-0 | 220 | 0.24 |
Polyvinyl fluoride PVF | 1.38 | 53 | 0.126 | 10.4 | 19.7 | 94 V-0 | 105 | 0 |
PET | 1.38~1.41 | 60 | 0.128 | 3.3 | 25.6 | 94 V-0 | 120 | 0.1-0.2 |
FR4 | 1.32 | 45~65 | 0.18 | 4.4 | 15.7 | 94 V-0 | 155 | 0.1 |
Voltage | 12kV DC |
Power | Megawatt |
Temperature range | -50ºC/+125ºC |
Relative humidity | 55ºC/95%RH(Standard) 85ºC/95%RH( extended) |
Inductor material | Copper, Aluminum |
Insulation material | Polyester dielectric film, rigid insulation board |
Production test | Partial discharge, high voltage, size |