Chi Mei Corporation PC/ABS Injection Molding for Electrical Components

1. Mold temperature: in terms of product surface and forming cycle, when the mold temperature is in the middle of the recommended temperature value, better forming products can be obtained.

 Higher mold temperatures tend to produce better fluidity, stronger binding lines, and less molding stress. A lower mold temperature than the recommended value may result in higher molding stress and damage to the integrity of the product.

2. Recommended back pressure: 50~100psi(0.35~0.7Mpa)

3. The injection volume of PC/ABS glue is recommended to be 30~80% of the capacity of the injection machine

TAIRILOY PC/ABS AC2300 is electroplated grade alloy resin, applied to automobile door handles, instrument panels, wheel covers, automobile parts, consumer electronic components, TAIRILOY® PC/ABS adhesive has ABS machinability and low temperature mechanical properties, but also has PC high impact and heat resistance characteristics. Can be applied to automobile parts, 3 c electronic products shell, shells of consumer electronics, household appliances, toys, board and other products, its application side, our factory has a high standard of production equipment and the pilot plant, with the development of new materials and processing technology of service ability, and the equipment of our factory also adopt strict environmental standards, has a mature production technology, Doubts about a pollution-free environment.