Silicon Oxynitride Resin Type High Temperature Adhesive Iota R2400

Ratio: two components, A-base glue; B-curing agent; A:B mass ratio A:B= 100:6

Adhesive contains base adhesive A curing agent B two components, in use will be A:B=100: 6 ratio of adding curing agent mix, mixed after the operation of adhesive ~30 minutes

Application: Be used for bonding and sealing between metals, ceramics or composite materials

Operation process
Specific process steps:
Appropriate amount of A component, according to A:B=100: 6 proportion to add curing agent B, stir evenly, can be coated coated with a scraper or scalpel, the adhesive evenly coated on the surface of the workpiece, the thickness of the rubber layer in 50~100 microns, in order to avoid the rubber layer is too thick when the flow of glue phenomenon, can be used for multiple coating process The extruded excess adhesive is removed with a scraper, and then the adhesive is fixed by tooling at room temperature curing, room temperature curing for 5~7 days, and a certain pressure is applied to the specimen when curing;

Storage

Store part B in A dry and cool place and part A in A dry and sealed place