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Suitable for High Precision Large Workpiece Single-Plane Grinding and Polishing
Suitable for High Precision Large Workpiece Single-Plane Grinding and Polishing
Suitable for High Precision Large Workpiece Single-Plane Grinding and Polishing
Suitable for High Precision Large Workpiece Single-Plane Grinding and Polishing
Suitable for High Precision Large Workpiece Single-Plane Grinding and Polishing
Suitable for High Precision Large Workpiece Single-Plane Grinding and Polishing

Suitable for High Precision Large Workpiece Single-Plane Grinding and Polishing

Min.Order: 1
Product origin: Shenzhen, Guangdong, China
Infringement complaint: complaintComplaint
US$ 8000 ~ 20000

Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
This grinding machine is suitable for high-precision single-plane grinding and polishing of large workpieces and mass production of small workpieces. Such as: aluminum alloy, stainless steel, light guide plate, ceramic, valve plate, diamond drill bit for oil drilling, etc.
Products Show
High precision grinding machine (with water cooled shaving machine) Equipment features:
1. The flatness of the grinding disc can reach ±0.002mm; The flatness of the workpiece with a diameter of 50mm can reach 1/4 wavelength.
2. The grinding machine can be pressurized by pressing the weight block, and the pressure is adjustable;
3. The series of grinding machine adopts PLC program control, touch screen operation panel, grinding disk rotation and timing and grinding time can be directly input on the touch screen, the speed is adjustable, easy to operate
4. The grinding disc adopts water-cooled circulation system, the temperature can be controlled at low temperature, the error is ±1ºC to solve the problem of heat generated in the grinding process to deform the workpiece.
5. The gravity execution cylinder has a protective locking function (that is, it can maintain the original state in the state of power failure)
6. The equipment is equipped with three stations (including three sets of weight pressing and self-locking systems), which can simultaneously carry out polishing and grinding processing of three groups of products.
7. Grinding liquid (or coolant) circulation filling system;

APPLICATION
Single
Plate
Lapping
& Polishing		Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone		Sealingvalve and sealing ring(liquid, oil, gas)
SemiconductorLED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
PlasticPE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat)back plate
PCBadhesive, coating, circuit
Optics(flat)optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radaroxide coating plate
Gemstonejade, sapphire, agate, etc.
Othersgraphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION
Standard Specification
Machine ModelFD3803FD4603FD6103FD9104
Plate DiameterΦ380 mm / 15 inchesΦ460mm / 18 inchesΦ610mm / 24 inchesΦ910mm / 36 inches
Max. Workpiece Diameter
(without conditioning ring)		Φ180 mmΦ220 mmΦ270 mmΦ420 mm
Conditioning Ring DiameterΦ180 mmΦ220 mmΦ270 mmΦ420 mm
Number of Station3334
Plate Rotate Speed0-140 rpm0-140 rpm0-120 rpm0-90 rpm
Facing & Grooving Speed
(Not include in Polishing)		0-120 mm/m0-120 mm/m0-120 mm/m0-120 mm/m
Total Weight450 kg780 kg1000 kg1600 kg
Total Floor Space670×940 mm1030×730 mm1920×840 mm2100×1300 mm
Built-In Optional Kits
GradeStandardUpgradedAdvanced
ControlsDigitalDigitalTouch-Screen PLC
Pressure SourceHand Weight BlockPneumatic Weight Block
Manual		Pneumatic Press
Integrated with PLC
Slurry Supply System-ManualDigital, Manual
Cylinder Bar Drive System-ManualIntegrated with PLC
Conditioning Ring Drive System-ManualIntegrated with PLC
Machine Enclosure-Framed by Aluminum AlloyFramed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)




Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
 

 

 

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