White 96% 99.6% Aluminum Oxide Al2O3 Alumina Ceramic Substrate for Circuit

Min.Order: 10

Product origin: Shenzhen, Guangdong, China

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US$ 0.5 ~ 20

Description

White 96% 99.6% Aluminum Oxide Al2O3 Alumina Ceramic Substrate for Circuit

Ceramic substrate is a commonly used electronic packaging substrate material. Compared with plastic and metal substrates, ceramic substrate has the following advantages:

1) Good Insulation
Generally speaking, the higher substrate resistance, the better reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.

2) Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.

3) Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting point, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.

4) High Thermal Conductivity
Ceramic substrate materials are widely used in high-reliability, high-frequency, high-temperature resistance, and strong air-tight product packaging in aviation, aerospace and military engineering. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuit (HIC) and multi-chip module (MCM) ceramic packages.

For material properties, please refer to the table below.

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm³	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10¹⁴	≥10¹⁴
Dielectric Strength	DC	KV/mm	≥15	≥15

1. Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
Thickness (mm)	As Fired	Lapped	Polished	Rectangular	Square	Round	Molding Technique
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.5	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
Thickness (mm)	As Fired	Lapped	Polished	Rectangular	Square	Round	Molding Technique
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

2. Product Tolerances

Alumina Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<0.3	±0.03	±0.01
	0.30-1.0	±0.05	±0.01
	T>1.0	±10%	±0.01

3. Surface Roughness

Alumina Ceramic Substrate
Material	Surface Roughness (μm)
Material	As Fired	Lapped	Polished
96% Al2O3	Ra 0.2-0.75	Ra 0.3-0.7	Ra ≤0.05
99.6% Al2O3	Ra 0.05-0.15	Ra 0.1-0.5	Ra ≤0.05

4. Laser Processing

(1) Hole Size

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing

Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.