| SHENZHEN OKEY CIRCUIT CO.,LTD |
| PCB Manufacturing Capabilities: |
| Layers | 1-20 Layers |
| Laminate | FR4, H-TG, CEM, Aluminum, Copper Base, Teflon, Rogers, |
| Ceramics, Iron Base |
| Max. Board Size | 1200*480mm |
| Min.Board Thickness | 2-Layer 0.15mm |
| 4-Layer 0.4mm |
| 6-Layer 0.6mm |
| 8-Layer 1.5mm |
| 10-Layer 1.6-2.0mm |
| Min. Line Width/Trace | 0.1mm(4mil) |
| Max. Copper Thickness | 10 OZ |
| Min. S/M Pitch | 0.1mm(4mil) |
| Max. S/M Pitch | 0.2mm(8mil) |
| Min. Hole Dia. | 0.2mm(8mil) |
| Hole Dia. Tolerance(PTH) | ±0.05mm(2mil) |
| Hole Dia. Tolerance(NPTH) | ±0.05mm(2mil) |
| Hole Position Deviation | ±0.05mm(2mil) |
| Outline Tolerance | ±0.1mm(4mil) |
| Twist/Bent | 0.75% |
| Insulation Resistance | >1012Ω Normal |
| Electric Strength | >1.3kv/mm |
| S/M Abrasion | >6H |
| Thermal Stress | 288ºC 10Sec |
| Test Voltage | 50-300V |
| Min. Blind/Buried Via | 0.15mm(6mil) |
| Surface Treatment | OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver, |
| Ag/Silver Plating,Immersion Tin,Tin Plating |
| Testing | E-test, Fly probe test |
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| PCB Assembly Manufacturing Capabilities: |
| Type of Assembly | SMT (Surface-Mount Technology) |
| DIP (Dual Inline-pin Package) |
| SMT & DIP mixed |
| Double-sided SMT and DIP assembly |
| Solder Type | Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS) |
| Components | Passives parts, smallest size 0201 |
| BGA, uBGA, QFN, SOP, TTSOP, and Leadless chips |
| Fine Pitch to 0.8Mils |
| BGA Repair and Reball, Part Removal and Replacement |
| Connectors and Terminals |
| Bare Board Size | Smallest:0.25''x 0.25'' (6.35mm x 6.35mm) |
| Largest: 20'' x 20'' (508mm x 508mm) |
| Largest LED PCB: 47'' x 39'' (1200mm x 480mm) |
| Min. IC Pitch | 0.012'' (0.3mm) |
| QFN Lead Pitch | 0.012'' (0.3mm) |
| Max. BGA size | 2.90'' x 2.90'' (74mm x 74mm) |
| Testing | X-ray Inspection |
| AOI (Automated Optical Inspection) |
| ICT (In-Circuit Test)/Functional Testing |
| Component Packaging | Reels, cut tape, Tube and tray, Loose parts and bulk |
Complaint
