Complaint
High thermal conductivity alumina as filler
Overview: The product has spherical, near spherical and angular dense crystal structure, which has good dispersion, good interface compatibility with organic polymer materials, it can meet the requirements of high filling ;The product has narrow particle size distribution, high chemical purity, good thermal conductivity and insulation performance.
Application: the products are mainly used in silicone-based and epoxy-based polymer materials, the main application are epoxy potting glue, thermal double-sided tape, thermal plastic, electronic encapsulation, etc., which can replace the imported similar products .
| Item | Brand Name | A-SP-5 | A-SP-20 | A-SP-45 | A-SP-70 | A-SP-90 | ||||
| Composition | SiO2 (%) ≤ | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | ||||
| Fe2O3 (%) ≤ | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | |||||
| Na2O (%) ≤ | 0.05 | 0.05 | 0.05 | 0.04 | 0.04 | |||||
| Adsorbed water(%)≤ | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | |||||
| Physical properties | Partical Size(μm) | 5~6 | 18~22 | 45~50 | 70~80 | 90~110 | ||||
| α-Alumina(%)≥ | 30 | 40 | 50 | 60 | 70 | |||||
| SBET(m2/g) ≤ | 1 | 0.8 | 0.5 | 0.3 | 0.3 | |||||
| PH | 7.0-9.0 | 7.0-9.0 | 7.0-9.0 | 7.0-9.0 | 7.0-9.0 | |||||
| Electrical Conductivity(μs/cm)≤ | 70 | 70 | 70 | 70 | 70 | |||||
For your Application, you can choose from one of our many standard materials, or work with our responsive sales and research and development teams to customize a material that meets your needs.
