S-SnCu0.7 Tin Copper Alloy Wire Solid Solder Wire Basic customization

S-SnCu0.7 Tin Copper wire's melting point is close to leaded metal spraying materials and its performance on the capacitor is also close to the leaded metal spraying materials. It is an ideal metal spaying material for laminated capacitors.

The surface is smooth and clean without bubbles, burrs,s or other defects.
The mechanical property and surface quality are highly uniform.
The metal spraying of metalized film capacitors is of strong adhesion with good weldability and low loss angle.
The product conforms to the requirements of EU RoHS, REACH, and relevant domestic laws and regulations for environmental protection. 

Product code: solder wire

Chemical composition:

ITEM	Melting Range (ºC)	Elements (%)
		Sn	Ag	Cu	Sb	Pb	Cd	Fe	As	Al	Zn	Bi	TTL
S-SnCu0.7	227	REMAINING	0.1	0.5-0.9	0.1	0.05	0.0012	0.02	0.03	0.001	0.001	0.015	0.2
S-SnCu0.3	227~235	REMAINING	0.1	0.2-0.4
S-SnCu3	227~310	REMAINING	0.1	2.5-3.5
S-SnAg3	221~224	REMAINING	2.8-3.2	0.05
S-SnAg3.5	221	REMAINING	3.3-3.7	0.05
S-SnAg5	221~240	REMAINING	4.8-5.2	0.05
S-SnAg1Cu0.5	217~227	REMAINING	0.8-1.2	0.3-0.7
S-SnAg1Cu0.7	217~224	REMAINING	0.8-1.2	0.5-0.9
S-SnAg3Cu0.5	217~220	REMAINING	2.8-3.2	0.3-0.7
S-SnAg4Cu0.5	217~219	REMAINING	3.8-4.2	0.3-0.7
S-SnAg3.5Cu0.7	217~218	REMAINING	3.3-3.7	0.5-0.9
S-SnAg3.8Cu0.7	217	REMAINING	3.6-4.0	0.5-0.9
S-SnCu0.7Ag0.3	217~227	REMAINING	0.2-0.4	0.5-0.9
S-SnCu4Ag1	217~353	REMAINING	0.8-1.2	3.5-4.5
S-SnCu6Ag2	217~380	REMAINING	1.8-2.2	5.5-6.5
S-SnSb5	235~240	REMAINING	0.1	0.05	4.5-5.5
S-SnZn9	199	REMAINING	0.1	0.05	0.1						8.5-9.5

Diameter: 0.5mm≤Ф≤2.5mm

DIAMETER (MM)	PERMISSIBLE VARIATION
0.5-0.8	±0.03
0.8-1.2	±0.07
1.2-2.5	±0.1

Applicable to the heat-labile components cryogenic package field manual soldering iron welding, automatic welding; suitable for thermal fuse, thermal protection, thermal fuse.
main used for the soldering of precision instruments, electrical and electronics, wave soldering and circuit board elements and aviation.

Solder is an indispensable material for the manufacture of electronic products. Tin wire, tin bar, and tin paste are the most widely used electronic welding materials, the technical level depends on the performance of solder joints and welding process performance.

Tin base Babbitts are considered superior to Lead base alloys for most applications because they are easier to pour and provide a good bond between the bearing shell and lining.  In this process, Babbitt ingots are melted and then poured into bearing cavities, allowed to harden, and then the surface is machined down to meet the required tolerances.


Product packing:

Hard paper drum	100-150 kg	outer diameter 550 mm, inner diameter300mm, variable height
Hard paper drum	20-50 kg	outer diameter 400 mm, inner diameter190mm. variable height
Plastic spool	15 kg	flange300mm, width100mm, center hole:55mm
Plastic spool	0.5-10 kg
bundle	10-20 kg

Pallet will be used, such as 1100mmX1100mm, 1200mmX800mm, 1000mmX1000mm, 800mmX800mm. There is a variety of Lead-free solder wire that has a smooth surface, neat coiling, beautiful appearance, uniform distribution of additives, and good continuity. Less splash of additives in the welding process, good mobility, good we1ability, less smoke, less oxide slag, and bright welding spots. for use as coating feedstock material for the electric arc wire spray processes.
Widely used in various wave soldering and manual welding of television, audio, capacitors, circuit boards, and communications equipment. and look forward to your cooperation!