Complaint
Item | Speci. |
Layers | 1~8 |
Board Thickness | 0.1mm-0.2mm |
Substrate Material |
PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) |
Conductive Medium | Copper foil(1/3oz,1/2oz,1oz,2oz) Constantan Silver Paste Copper Ink |
Max Panel Size | 600mm×1200mm |
Min Hole Size | 0.1mm |
Min Line Width/Space | 3mil(0.075mm) |
Maximum imposition size (single & double panel)
| 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples) |
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)
| 610*1650mm |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 0.10mm--6.30mm |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 2:1(Minimum aperture 0.1mm) 5:1(Minimum aperture 0.2mm) 8:1(Minimum aperture 0.3mm) |
SMT Mini. Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Impedance Control Tolerance | +/-10% |
Surface finish | ENIG, HASL, Chem. Tin/Sn |
Soldermask/Protective Film | PI(0.5mil,1mil,2mil)(Yellow, White, Black) PET(1mil,2mil) Solder mask (green, yellow, black...) |
Silkscreen | Red/Yellow/Black/White |
Certificate | UL, ISO 9001, ISO14001, IATF16949 |
Special Request | Glue(3M467,3M468,3M9077,TESA8853...) |
Material Suppilers | Shengyi, ITEQ, Taiyo, etc. |
Common Package | Vacuum+Carton |
Monthly production capacity/m² | 60,000 m² |
| Production capacity of hot-sale products | |
| Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
| Technical Capability | Technical Capability |
| Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Alurminum base, Copper base |
| Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
| Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole size: 0.1mm(dirilling hole) | Min.Hole size: 12mil(0.3mm) |
| Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
| Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
| Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
| NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
| Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
| Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
| Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
| Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
| Category | Quickest Lead Time | Normal Lead Time |
| Double sideds | 24hrs | 120hrs |
| 4 Layers | 48hrs | 172hrs |
| 6 Layers | 72hrs | 192hrs |
| 8 Layers | 96hrs | 212hrs |
| 10 Layers | 120hrs | 268hrs |
| 12 Layers | 120hrs | 280hrs |
| 14 Layers | 144hrs | 292hrs |
| 16-20 Layers | Depends on the specific requirements | |
| Above 20 Layers | Depends on the specific requirements | |
