Aln Insulation Sheet Laser Scribing Aluminum Nitride Ceramic Substrate PCB

Min.Order: 1

Product origin: Shenzhen, Guangdong, China

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US$ 0.5 ~ 100

Description

AlN Insulation Sheet Laser Scribing Aluminum Nitride Ceramic Substrate PCB

About Laser Scribing

Due to the special properties of ceramic substrate materials, they

generally cannot be processed by traditional processing techniques,

and laser is an ideal tool for processing such materials.

Laser scribing has high precision, fast speed, no scratch on the

workpiece and no mechanical deformation, and can process any

graphics.

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

AlN Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
Thickness (mm)	As-fired	Lapped	Polished	Rectangular	Square	Round	Molding Technique
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Laser Processing

(1) Hole Size

AIN Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing

AIN Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.5<T≤1.0	50%±3%
1.0<T≤1.2	55%±3%
1.2<T≤1.5	60%±3%
2.0	45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

AIN Ceramic Substrate
Item	Unit	Value
Mechanical Properties
Color	/	Gray
Density	g/cm³	≥3.33
Flexural Strength	MPa	≥380
Water Absorption	%	0
Camber	Length‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	ºC	>1000
CTE (Coefficient of Thermal Expansion)	20-800ºC, 1×10^-6/ºC	4-6
Thermal Conductivity	20ºC, W/m·K	170-230
Electrical Properties
Dielectric Constant	1MHz	8-10
Volume Resistivity	20ºC, Ω·cm	≥10¹³
Dielectric Strength	KV/mm	≥17

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact us today with your specifications.

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