Mirror Polishing Fine Grinding Aluminum Nitride Aln Ceramic Substrate PCB

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Product origin: Shenzhen, Guangdong, China
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US$ 0.5 ~ 100

Description
Mirror Polishing Fine Grinding Aluminum Nitride AlN Ceramic Substrate PCB
Product Introduction

 


Three Major Benefits of Lapping and Polishing

1. A finer pattern can be obtained.

2. Better parallelism of the upper and lower surfaces (thickness

tolerance) can be achieved.

3. A thinner metallization layer can be acquired.


Characteristics of Aluminum Nitride Ceramic Substrates

1. Great Thermal Conductivity.

2. Low Coefficient of Thermal Expansion (CTE).

3. High or Very Low Service Temperature.

4. Small Dielectric Loss.

5. High Wear & Chemical Resistance.

6. High Heat Resistance.

7. High Mechanical Strength.

8. 0% Water Absorption.

 
Applications

Product Parameters
AlN Ceramic Substrate
ItemUnitValue
Mechanical Properties
Color/Gray
Densityg/cm³≥3.33
Flexural StrengthMPa≥380
Water Absorption%0
CamberLength‰≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)ºC>1000
CTE (Coefficient of
Thermal Expansion)
20-800ºC, 1×10-6/ºC4-6
Thermal Conductivity20ºC, W/m·K170-230
Electrical Properties
Dielectric Constant1MHz8-10
Volume Resistivity20ºC, Ω·cm≥1013
Dielectric StrengthKV/mm≥17
Manufacturing Capacity

1. Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

AlN Ceramic Substrate
Thickness (mm)Maximum Size (mm)ShapeMolding Technique
As-firedLappedPolishedRectangularSquareRound
0.1-0.2 50.850.8 Tape Casting
≥0.2 114.3114.3 Tape Casting
0.38140×190140×190120 Tape Casting
0.5140×190140×190120 Tape Casting
0.635140×190200200Tape Casting
1140×190300200Tape Casting
1.5 300200 Tape Casting
2 300200 Tape Casting
2.5 300  Tape Casting
3 300  Tape Casting
 450  Isostatic Pressing
10 450  Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

2. Product Tolerances
 
AlN Ceramic Substrate
ItemSubstrate Thickness (mm)Standard Tolerance (mm)
 
Best Tolerance (mm)
 
Laser Cutting Tolerance (mm)
Length and Width Tolerance/±2 ±0.15
Thickness ToleranceT<1.0±0.03±0.01 
1.0≤T<1.5±0.05±0.01 
T≥1.5±0.07±0.01 

3. Surface Roughness
 
AlN Ceramic Substrate
MaterialSurface Roughness (μm)
As FiredLappedPolished
AINRa 0.4Ra 0.3-0.7Ra ≤0.05

4. Laser Processing

(1) Hole Size

 
AlN Ceramic Substrate
Hole Diameter (mm)Standard Tolerance (mm)
φ≤0.50.08
φ>0.50.2

(2) Laser Scribing
 
AlN Ceramic Substrate
Substrate Thickness (mm)the Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.340%±5%
0.5<T≤1.050%±3%
1.0<T≤1.255%±3%
1.2<T≤1.560%±3%
2.045% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.
Packaging & Shipping

Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.

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