Complaint
| Process | Industry by Substance | Industry by Applicability | |
| Double Plate Lapping & Polishing | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
| Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) | ||
| Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR | ||
| Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass | ||
| Gemstone | jade, sapphire, agate, etc. | ||
| Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. | ||
| *NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed. | |||
| Standard Specification | |||||
| Machine Model | FD6B | FD9B | FD13-6B | ||
| Lower Plate Diameter | Φ386 mm / 15 inches | Φ640 mm / 25 inches | Φ973 mm / 38 inches | ||
| Upper Plate Diameter | Φ386 mm / 15 inches | Φ640 mm / 25 inches | Φ973 mm / 38 inches | ||
| Star Wheel Parameter | DP 12, Z=66, A=20° | DP 12, Z=108, A=20° | DP 19.3, Z=152, A=20° | ||
| Conditioning Ring Parameter | DP 12, Z=66, A=20° | DP 12, Z=108, A=20° | DP 19.3, Z=152, A=20° | ||
| Max. Workpiece Diameter | Φ120 mm | Φ180 mm | Φ290 mm | ||
| Process Thickness | 0.2mm≤N≤20mm | 0.2mm≤N≤25mm | 0.2mm≤N≤30mm | ||
| Number of Station | 3≤N≤5 | 3≤N≤5 | 3≤N≤5 | ||
| Plate Rotate Speed | 0-60 rpm | 0-60 rpm | 0-50 rpm | ||
| Total Weight | 600 kg | 2000 kg | 3200 kg | ||
| Total Floor Space | 700×950 mm | 1350x960 mm | 1700×1380 mm | ||
| Built-In Optional Kits | |||||
| Grade | Standard | Advanced | |||
| Slurry Supply System | - | Integrated with PLC | |||
| Facing and Grooving System | - | Integrated with PLC | |||
| Machine Enclosure | - | Framed by Metal Plate | |||
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. | |||||
