.Key Aluminum Nitride Properties | |
Good dielectric properties | |
High thermal conductivity | |
Low thermal expansion coefficient, close to that of Silicon | |
Non-reactive with normal semiconductor process chemicals and gases | |
.Typical Aluminum Nitride Uses | |
Substrates for electronic packages | |
Heat sinks | |
IC packages | |
Power transistor bases | |
Microwave device packages | |
Material processing kiln furniture | |
Semiconductor processing chamber fixtures and insulators | |
Molten metal handling components |
1. AlN is susceptible to surface oxidization. When this happens, a layer of Aluminum Oxide forms. This does help to protect the material, however, it impacts the thermal conductivity (Alumina is ~30 W/m.K). In oxidizing atmospheres, this happens around 700°C. In inert atmospheres this layer protects the AlN up to ~1350°C. Bulk oxidation will occur at temperatures above this.
2. Coefficient of Thermal Expansion (CTE) describes how the size of an object changes with a change in temperature.