Complaint
| model | CT2300 | CT3000 | CT3100A |
| Z stroke | 0.4" | ||
| Resolution | 1μm | ||
| Wire feeding degree | 30° | 30° (45° optional) | |
| Wire diameter | 1.0-2.0 MIL | 0.8-2.0 MIL | 1.0-2.0 MIL |
| Bonding force | 15-80 gm | ||
| Bonding power | 0-2W adjustable | ||
| Bonding time | adjustable | ||
| Distance between | 4.8 mm | ||
| Bonding head and base | Work stage | ||
| XY stroke | 2"*2" | 2"*2" | 3"*3" |
| Rotary range | No limit | ||
| Base dimension | Max rotary R: 380mm | ||
| transducer | Light weight aluminum alloy | ||
| Process scan range XY | ±1mm (Magnification 3.5 times) | ||
| Process scan range rotary | ±15° | ||
| Optical system | 2.5X process control | ||
| Storage | Up to 99 programs, up to 1000 COB chips per program, up to 1000 lines per chip | ||
| Voltage | 2 phase 220V | ||
| Frequency | 50/60 HZ | ||
| Power | 800W | ||
| weight | 240kg | 270kg | 280kg |
| size | 1050*750*1400mm | 630*700*1350mm | 750*1050*1450mm |
| Bonding speed | 50ms/wire for 2mm |
| Bonding accuracy | ±3.0 μm |
| Wire length | Max.8mm |
| Wire diameter | 15-50μm |
| Wire type | Au, Ag, Alloy, CuPd, Cu |
| Bond type | Single line /BSOB/BBOS |
| Loop control | Support ultra-low arc |
| Bonding area | 56mm*65mm |
| XY resolution | 0.1μm |
| Transducer system | 138kHZ |
| PR accuracy | ±0.37μm,±0.74μm |
| Applicable magazine | 120-305*45-98*50-180mm |
| Magazine pitch | Min 1.5mm |
| Applicable lead frame | 100-300*40-90*0.1-1.3mm |
| Different lead frame | <5min |
| Same lead frame | <15min |
| Operation interface | <4min |
| Overall dimension | Chinese/English |
| volume | 950mm*920*1850mm |
| Weight | 750kg |
| Voltage | 190~240V |
| Frequency | 50HZ |
| Compressed air | 0.6-0.97bar |
| Air consumtion | 80L/min |
