High efficiency and good marking effect,small volume, and the transportation is convenient;
High electro-optic conversion efficiency, narrow laser pulse width, high peak power.
Small heat affected area,suitable for high-precision machining of scribing and various complex pattern marking fast,good stability.
Widely used in marking on packing materials of food,medicines,cosmetics and wire,drilling tiny hole (hole diameter D≤10μm)Flexible PCB,LCD,TFT marking and slicing.Metallic and non metallic materials thin film removal.Silicon wafer tiny hole and dead hole processing.
It is suitable for the surface marking of glass, polymer materials, etc., micro-hole processing.
Complaint
