Complaint
| ITEM | CAPABILITY | ITEM | CAPABILITY |
| Layers | 1-20L | Thicker Copper | 1-6OZ |
| Products Type | HF(High-frequency) &(Radio Frequency)board, Imedance controlled board, HDIboard, BGA & Fine Pitch board | Solder Mask | Nanya & Taiyo; LRI & Matt Red. green,yellow, white, blue, black |
| Base material | FR4(Shengyi China,ITEQ, KB A+,HZ),HITG,FrO6,Rogers,Taconic,Argon,Nalco lsola and so on | Finished Surface | Conventional HASL,Lead-free HASL,FlashGold,ENIG (lmmersion Gold) OSP (Entek),lmmersion TiN, lmmersion Silver,Hard Gold |
| Selective Surface treatment | ENIG(immersion Gold) + OSP ,ENIG(immersion Gold) + Gold Finger, Flash Gold Finger, immersionSlive + Gold Finger, Immersion Tin + Gold Finger | ||
| Technical Specification | Minimum line width/gap: 3.5/4mil (laser dril) Minimum hole size: 0.15 mm(mechanical drill/4 mill laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 6Oz Max Production size: 600x1200mm Board Thickness: D/S: 0.2-70mm,Mulltilayers: 0.40-7.Omm Min Solder Mask Bridge: ≥0.08mm Aspect ratio: 15:1 Plugging vias capability: 0.2-0.8mm | ||
| Tolerance | Plated holes Tolerance : ±0.08mm(min±0.05) Non-plated hole tolerance: ±O.05min(min+O/-005mm or +0.05/Omm) Outline Tolerance: ±0.15min(min±0.10mm) Functional test: lnsulating resistance: 50 ohms (normality) Peel off strength: 14N/mm Thermal Stress test: 265C.20 seconds Solder mask hardness: 6H E-test voltage: 50ov±15/-0V 3os Warp and Twist: 0.7%( semiconductor test board 0.3%) | ||
| 1 | SMT assembly including BGA assembly |
| 2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
| 3 | Component height: 0.2-25mm |
| 4 | Min packing: 0204 |
| 5 | Min distance among BGA : 0.25-2.0mm |
| 6 | Min BGA size: 0.1-0.63mm |
| 7 | Min QFP space: 0.35mm |
| 8 | Min assembly size: (X*Y): 50*30mm |
| 9 | Max assembly size: (X*Y): 350*550mm |
| 10 | Pick-placement precision: ±0.01mm |
| 11 | Placement capability: 0805, 0603, 0402 |
| 12 | High pin count press fit available |
| 13 | SMT capacity per day: 80,000 points |
| AOI Testing | Checks for solder paste Checks for components down to 0201 Checks for missing components, offset, incorrect parts, polarity |
| X-Ray Inspection | X-Ray provides high-resolution inspection of: BGAs/Micro BGAs/Chip scale packages /Bare boards |
| In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
| Power-up Test | Advanced Function Test Flash Device Programming Functional testing |
