1. Pure copper nickel plated can prevent heat pipe oxidation ,each heat pipe heat sink ability up to 45 watt.
2. Reflow soldering process The copper case is adopted to fit CPU,as well as improving optimal contact area and thermal conductivity
3. Fine machining micro convex copper base CPU contact areas reach 12.6cm²,the heat dissipate is more rapid.
4. 23KG Pressure type metal buckles 4mm Thicken profile aluminum base,ensure no deformed and high effective heat dissipation, Thicken M4 bud spring screws,the pressure is extend to the four corners via metal circle buckles, Ensure the closely fit between radiator and CPU.
5. 120mm Two mode of lighting fan 8 pcs lamp beads create 16.8 million colors ,support RGB/ARGB motherboard sync. equip EVA damping pad.Avoid resonance and reduce noise.
Tower CPU cooler S4 specification Overall Dimension:120*73*155mm Fan Dimension:120*120*25mm Rated Voltage:12v Rated Current :0.48A Max AirFlow:59.5 CFM Fan Speed :800-1800RPM Noise Level :35.5(dBA)
Complaint
