Complaint
| Product Parameters | |
| Alloy | Sn96.5Ag3Cu0.5 |
| Package | 500g/bottle |
| Melting point | 217ºC |
| Particles | 25 - 45um/20-38um |
| Viscosity | 190±20Pa.S |
| Product Specification | |||
| Type | Ingredient (WT%) | Melting point(ºC) | Application scenario |
Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
| Sn62.8Pb36.8Ag0.4 | 180-183 | ||
| Sn62.8Pb37Ag0.2 | 180-183 | ||
| Sn60Pb40 | 183-190 | ||
| Sn55Pb45 | 183-203 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
| Sn50Pb50 | 183-220 | ||
| Sn10Pb88Ag2 | 278 | High lead and high silver are suitable for welding of products such as high-precision instruments, semiconductors, automotive electronics, microtechnology, high-speed rail technology, aviation industry, etc. | |
| Sn5Pb92.5Ag2.5 | 287 | ||
| Sn62Pb36Ag2 | 175-182 | ||
Lead-free solder paste | Sn96.5Ag3.0Cu0.5 | 217 | High cost, good performance, suitable for high-demand welding |
| Sn98.5Ag1.0Cu0.5 | 220 | Lead-free medium temperature 1 silver has good thermal conductivity and electrical conductivity. Appropriate requirements for good tin strength, good cost control and high cost performance | |
| Sn99Ag0.3Cu0.7 | 227 | Low cost, high melting point. Can be used for less demanding welding | |
| Sn64.7Ag0.3Bi35 | 172 | Medium temperature lead-free soldering, suitable for: LED, USB, thermostat and other SMT patches and maintenance products, the temperature resistance does not exceed 230 ºC | |
| Sn64Ag1.0Bi35 | 172 | ||
| Sn42Bi58 | 138 | Low temperature lead-free soldering, suitable for: LED chip processing and maintenance fields | |
| Sn96.5Ag3.5 | 210 | Soldering paste is used for: structural parts, nickel plating, tin plating and other metal welding | |
