Complaint
Features and application fields of all kinds of Mo plates are as follows | ||
Classification | Feature | Application field |
widely used for manufacturing electron (ion) beam sputtering target, spare parts for ion implantation machine, heat sink of semiconductor, parts of electron tube, MOCVD equipment, and medical device, hot zone, crucible and supporting elements for sapphire crystal furnace, heater, heat shield, supporting element, and boat for vacuum and hydrogen shielded heating furnace | ||
Pure Mo plate treated in high temperature | High-purity, consistent in physical and chemical property, and excellent high temperature anti-deforming capability | Suitable for manufacturing base plate for precision electronic ceramics and rear-earth material |
By using oxide dispersion strengthening mechanism, certain plastic deformation could be performed under room temperature after being treated in high temperature because of its high strength, high recrystallization temperature and excellent high-temperature strength and improved recrystallization brittleness and high temperature anti-deforming capability | and boat for high temperature furnace | |
Lanthanum-doped Mo plate treated in high temperature | Excellent high-temperature strength, and low high temperature deformation due to its oxide dispersion strengthening effect and specific structure | suitable for making base plate for sintering fine ceramics and rear-earth ceramic, bearing rack, base plate and coat for high temperature heating furnace |
High temperature strength, low recrystallization temperature, and excellent high-temperature creep resistant performance because of its potassium bubble strengthening mechanism | particularly suitable for fabricating products with low high-temperature creep, such as components for electron tube, heater, heat shield, and so on for high temperature furnace | |
Doped Mo plate treated in high temperature | Low high-temperature creep due to its long grain staggered structure and high purity | suitable for making products with high requirement to purity and high-temperature creep, such as base plate for electronic ceramics sintering or heat-treating, supporting elements in electron tube, and so on |
Low anisotropy and good bending performance | particularly suitable for elongating, spinning, reinforcing and bending, and making elongating or spinning Mo crucible, Mo parts need to reinforce or bend, such as corrugated sheet, bending piece, Mo boat, and so on | |
Cross-rolled pure Mo plate treated in high temperature | Low anisotropy and good bending performance besides same performance of Lanthanum-doped Mo plate | particularly suitable for reinforcing and bending, and making reinforced or bended Mo parts with high temperature requirement, such as heating zone, bended fabricated parts, high-temperature Mo boat, and so on |
Some performance indexes of Mo plate as follows | |
Thickness(mm) | Erichsen value,≥(mm) |
0.10≤T<0.15 | 3.5 |
0.15≤T<0.2 | 4.0 |
0.2≤T<0.3 | 4.5 |
0.3≤T<0.4 | 5.0 |
0.4≤T<0.5 | 5.5 |
0.5≤T<0.6 | 6.0 |
0.5≤T<0.7 | 6.2 |
0.7≤T<0.8 | 6.5 |
0.8≤T<0.9 | 6.8 |
0.9≤T≤1.0 | 7.0 |
