Description
Semiconductor End Pump Laser Scribing Machine
Company Introduce video: https://youtu.be/Ojo3XnAzRdM
Product description
Perfect Laser produced a new generation of laser scribing machine PE-20W / 50W mainly used for scribing and cutting metal and silicon, germanium, gallium arsenide and other semiconductor material substrate , machinable solar panels, ceramic , aluminum foil, etc.
This solar cell scribing machine adopts fiber laser as work light source. The two-dimensional work table is controlled by computer, and could do kinds of movement according to what graphics be input in. It has high output power, high precision scribing, fast speed and could cut curve and straight line graph.
Technical Date| Model specification | PE-20W/50W Laser Scribing Machine |
| Laser wavelength | 1064nm |
| Laser power | 20W |
| Scribing line width | 50um |
| Scribing speed | 240mm/s |
| Scribing precision | ±10um |
| Workbench wide | 200×200mm |
| Temperature control precision | 0.5ºC |
| Working power supply | 220V/50Hhz/1.5KVA |
| Workbench | Cell automatic adsorption, dust removal |
| Cooling way | High precision and constant temperature circulating water cooling professional integration | Air cooling |
New design: Reconstruct the mechanical structure to make the device structure more compact, easier to use. Rewrite the part of the fiber laser scribing machine software source code to make software run more stable and faster.
High Configuration: Using 20W fiber laser, make the beam quality better (standard base model), kerf finer (30μm), and more smooth edge.
Free-maintenance: machine using standard modular design, the real free-maintenance uninterrupted continuous operation, without wasting replacement of wearing parts.
Easy operation: an integrated air-cooled device settings, device smaller, more simple operation.
Dedicated control software: specifically for laser scribing machine designed control software, easy to operate, can be displayed in real time dicing path.
High efficiency: T-station duplex alternating operation, improve work efficiency dicing maximum speed up to 200mm / s
Application and Market
? Able to adapt to silicon, polycrystalline silicon, amorphous silicon cells and dicing of silicon, germanium, gallium arsenide semiconductor material scribing and cutting.
Welcome to contact us for Perfect Laser engraving cutting solution !
Perfect Laser Co.,Ltd. (China)
Contact: Alice/ Sales Manager
Add: No.13 YangQiaohu Road, East Lake High-tech Development Zone, Optics Valley, Hubei, China
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