Complaint
| Rigid PCB Capability | |||
| Item | Standard | Advance | |
| Layers | 1-20 layers | 22-32 layers | |
| HDI | 1+N+1&2+N+2&3+N+3 | Elic | |
| Finger(Au) | 1-30U" | 30-50U" | |
| Max Panel Size | 520*800mm | 800*1200mm | |
| Min Panel Size | 5*5mm | 5*5mm | |
| Board Thickness | 0.1mm-4.0mm | 4.0mm-7.0mm | |
| Min Half Hole/Slot | 0.5mm | 0.3mm | |
| Min. Line Width/Space | 3mil/3mil | 2mil/2mil | |
| Min. Hole Size | 0.1mm | 0.075mm | |
| Inner Copper Thickness | 0.5-4oz | 0.5-5oz | |
| Outer Copper Thickness | 0.5-6oz | 0.5-9oz | |
| Tolerance | Line Width | ±10% | ±5% |
| PTH Hole Size | ±0.075mm | ±0.05mm | |
| NPTH Hole Size | ± 0.05mm | ±0.025mm | |
| Hole Precision | ±0.3 mil | ±0.2 mil | |
| Outline | ±0.1mm | ± 0.075mm | |
| Board Thickness | ±10% | ±5% | |
| Impedance Control | ± 10% | ± 8% | |
| Bow and Twist | 0.75% | 0.50% | |
| Board Material | FR-4, CEM-3, Rogers, High TG | ||
| Surface Finish | HAL(with Pb free), Plated Ni/Au, Imm Ni/Au, Imm Tin, OSP | ||
| Solder Mask | White, Black, Blue, Green, Grey, Red, Yellow, Transparent | ||
| Legend Color | White, Black, Yellow ect. | ||
| Certification | UL, IATF16949, ISO, RoHs | ||
| PCB Assembly Capability | ||||
| Item | Lot Size | |||
| Normal | Special | |||
| PCB(used for SMT)spec | (L*W) | Min | L≥3mm | L<2mm |
| W≥3mm | ||||
| Max | L≤1200mm | L > 1200mm | ||
| W≤500mm | W> 500mm | |||
| (T) | Min thickness | 0.2mm | T<0.1mm | |
| Max thickness | 4.5mm | T>4.5mm | ||
| SMT components spec | outline dimension | Min size | 201 | 1005 |
| (0.6mm*0.3mm) | (0.3mm*0.2mm) | |||
| Max size | 200mm*125mm | 200mm*125mm<SMD | ||
| component thickness | T≤6.5mm | 6.5mm<T≤15mm | ||
| QFP,SOP,SOJ(multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | |
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L<50mm |
| W≥30mm | ||||
| Max Size | L≤1200mm | L≥1200mm | ||
| W≤500mm | W≥500mm | |||
| (T) | Minimum Thickness | 0.8mm | T<0.8mm | |
| Maximum Thickness | 2mm | T>2mm | ||
| BOX BULID | FIRMWARE | Provide programming firmware files,Firmware + software installation instructions | ||
| Function test | Level of testing required along with test instructions | |||
| Plastic & Metal Casings | Metal Casting,Sheet Metal work,Metal Fabrication,Metal Fabrication,Metal and plastic extrusion | |||
| BOX BUILD | 3D CAD model of enclosure + specifications (include drawings, size, weight, colour, material, finish, IP rating, etc) | |||
| PCBA FILES | PCB FILE | PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) | ||
