Description
| SPECIFICATIONS |
|
| Current Rating: | 1A for Pin |
| Dielectric Withstanding Voltage: | AC100V R.M.S. |
| Insulation Resistance: | 100MΩ Min at DC500V |
| Contact Resistance(Low Level): | 40MΩ Max. |
| Operation Temperature: |
-55°C~+85°C |
| MATERIALS |
|
| Housing: | Thermoplastics,UL 94V-0 Rated |
| Contact: | Copper Alloy |
| Outer Shell: | Stainless Stell. |
| Inner Shell: | Stainless Stell. |
| Mid Shield Plate: | Stainless Stell. |
| EMC PAD: | Stainless Stell. |
This type can solder as a wire as well as dip type
Micro usb now are mainly adopted by mobile,charging devices ,I/O port. Small size are more
popular,save space for consumer product and wins market share.
MATERIALS
Housing: High Temperature Thermoplastic, Black Color, UL94V-0
Contact: Copper Alloy with 30u" Gold plating
Shell: Copper Alloy
ELECTRICAL PERFORMANCES
Low Level Contact Resistance: 50mΩ max.
Insulation Resistance: 100MΩ min.
Voltage Rating: 30Vrms max.
Current Rating: 1A per contact
Dielectric Withstand Voltage: 100 VAC
ENVIRONMENTAL
Operating Temperature: -25~85°C
MECHANICAL PERFORMANCE
Insertion Force: 35N max.
Unmating Force: 7N min.
Durability: 5,000 insertion/ extraction cycles
SPECIFICATIONS
Product Specification: GS-12-174
Packaging Specification: GS-14-873
PACKAGING
Tray
Tape/ Reel
TARGET MARKET / APPLICATION
Computers, laptops, servers
Printers, external drive units, monitors
Digital cameras, TV's, set-top box
Modems, keyboards, instrumentation
Point-of-sale equipment
Data
Servers
External Storage Systems
Supercomputers
Features and Benefits
Metal shielding on all sides
Superior shielding against RFI and EMI
Grounding fingers
Ground mating halves
Beveled metal pins
Provides ground to PCB and strong board retention
Detention lock
Securing mating retention
5,000 mating cycles
Rugged durability
Complaint
