Place of Origin: | Shenzhen (Mainland) | Brand Name: | XJY | Model Number: | xjy-pcb 218 |
Number of Layers: | 2-32 | Base Material: | FR-4, others | Copper Thickness: | 1oz-5oz |
Board Thickness: | 1mm | Min. Hole Size: | 0.6mm | Min. Line Width: | 4mil |
Min. Line Spacing: | 4mil | Surface Finishing: | HAL,Immersion gold, Immersion silver | certificate: | ISO9001, ISO14001,TS16949, UL certifications |
solder mask color: | green,red,blue,yellow,white | shipping term: | by FEDEX/DHL/EMS/TNT/UPS | Payment: | T/T,Western Union,Paypal |
MOQ: | 1 Piece | Delivery: | 2-15 days after your payment | Packaging: | vacuum packing, anti-static package |
Items | Single/Double-sided Board/Multilayer Board/FPC(1-24Layer) | ||
Base Materials | FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo | ||
Finish copper thickness | Outer 6 OZ,Inner 4 OZ | ||
Surface finish | ENIG, ImAg, ImSn, OSP, HASL,Plating gold | ||
Finished Board Size | Max Double-sided Board | 640mm χ 1100mm | |
Max Multilayer Board | 640mm χ 1100mm | ||
Finished Board Hole Size (PTH Hole) | Min Finished Board Hole Size | 0.15mm | |
Conductor Width and Spacing | Min Conductor Width | 0.01mm | |
Min Conductor Spacing | 0.01mm | ||
Thickness of Plating and Coating Layer | PTH Wall Copper Thickness | >0.02mm | |
Tin Solder Thickness ( Hot Air Leveling ) | >0.02mm | ||
Nickl/Gold Thickness | For customer special need | ||
Nickl Plating Layer | >2um | ||
Gold Plating Layer | >0.3um | ||
Bare Board Test | Single Side Test | Max Test Point | 20480 |
Max Board Test Size | 400mm χ 300mm | ||
Double Side Test | Max Test Point | 40960(General Use) | |
4096(Special Use) | |||
Max Board Test Size | 406mm χ 325mm | ||
320mm χ 400mm | |||
Min Test pitch of SMT | 0.5mm | ||
Test Voltage | 10-250V | ||
Mechanical Process | Chamfer | 20°, 30°, 45°, 60° | |
Angle Tolerance | ± 5° | ||
Deepness Tolerance | ± 0.20mm | ||
V-Cut Angle | 20°, 30°, 45° | ||
Board Thickness | 0.1-3.2mm | ||
Residues Thickness | ± 0.025mm | ||
Cell Paraposition Precision | ± 0.025mm | ||
Tolerance of Out-shape Process | ± 0.1mm | ||
Board Warp | Max Value | 0.7% | |
Optical Plotting | Max Plotting Area | 66mm χ 558.8mm | |
Precision | ± 0.01mm | ||
Repetitive Precision | ± 0.005mm |