Auto Single Double Side Multilayer PCB Immersion Gold

Min.Order: 1

Product origin: Shenzhen, Guangdong, China

Infringement complaint:

Complaint

US$ 0.031 ~ 0.41

Description

Technical Capabilities
Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Max. Board size		2000×610mm
Min. board Thickness		2-layer 0.15mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
Min. line Width/Space		0.1mm(4mil)
Max. Copper thickness		10OZ
Min. S/M Pitch		0.1mm(4mil)
Min. hole size		0.2mm(8mil)
Hole dia. Tolerance (PTH)		±0.05mm(2mil)
Hole dia. Tolerance		,+0/-0.05mm(2mil)
Hole position deviation		±0.05mm(2mil)
Outline tolerance		±0.10mm(4mil)
Twist & Bent		0.75%
Insulation Resistance		>10 12 Ω Normal
Electric strength		>1.3kv/mm
S/M abrasion		>6H
Thermal stress		288°C 10Sec
Test Voltage		50-300V
Min. blind/buried via		0.15mm (6mil)
Surface Finished		HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
Materials		FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm

1-10 Layers FR-4 Lead Free HASL PCB

1.PCB layer:1-12 layers
2.PCB Certificate:ISO UL REACH and RoHS
3. Material:FR 4
4.Best price with excellent after-service

Our PCB sell well at Eurpe, America and Asia, passed UL ISO Certificates and meet ROHS, REACH standards. We have rich experience in PCB field to serve your needs.

Welcome to contact us for more details and talk further business.
Inquiries are typically answered within 24 hours .
Wish you all the best and prosperous business.

NO	Item	Technical capabilities
1	Layers	1-12 layers
2	Max. Board size	2000×610mm
3	Min. board Thickness	2-layer 0.25mm
		4-layer 0.6mm
		6-layer 0.8mm
		8-layer 1.5mm
		10-layer 1.6~2.0mm
4	Min. line Width/Space	0.15mm(4-5mil)
5	Max. Copper thickness	10OZ
6	Min. S/M Pitch	0.15mm(4-5mil)
7	Min. hole size	0.2mm(8mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	0.75%
13	Insulation Resistance	>10 12 Ω Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C10Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.2mm (8mil)
19	Surface Finished	HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20	Materials	FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base