1 | Layers | Single Sided,2 to 18 Layer |
2 | Board material type | FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more |
3 | Compound material lamination | 4 to 6 layers |
4 | Maximum dimension | 610 x 1,100mm |
5 | Dimension tolerance | ±0.13mm |
6 | Board thickness coverage | 0.2 to 6.00mm |
7 | Board thickness tolerance | Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% |
8 | DK thickness | 0.076 to 6.00mm |
9 | Minimum line width | 0.10mm |
10 | Minimum line space | 0.10mm |
11 | Outer layer copper thickness | 8.75 to 175µm |
12 | Inner layer copper thickness | 17.5 to 175µm |
13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
16 | Hole position tolerance (mechanical drill) | 0.075mm |
17 | Laser drill hole size | 0.10mm |
18 | Board thickness and hole diameter ratio | 10:01 |
19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
20 | Minimum solder mask | Ø0.10mm |
21 | Minimum size of solder mask separation ring | 0.05mm |