Description
Laser cutting and technology:
Laser cutting is a technique that uses laser beam to interact with materials to precisely cut, surface, punch, scribe, etch, nuclear, and micro-machine materials.
Laser processing features:
· High precision, high performance and high efficiency
· Small photoelectricity, concentrated energy, and less thermal impact
· No contact with processed workpieces, no pollution to the price
· Fast punching and smooth hole
· The laser cutting seam is thin, fast and low in heat.
· Round and dense group density.
Application range:
a) LED chip manufacturing / wafer level chip package
b) touch screen of the navigation device
c) Semiconductor / Lighting
d) LCD/MEMS (pressure sensor, accelerometer...)
e) Research / Aviation / Military
f) Consumer Electronics Damage Protection Glass
g) Life sciences (micro-channels, etc.)
h) and many other customer-specific applications
Main technical indicators of glass shape processing
| Thickness: >0.1mm
| Roundness: ±0.001mm
| Collapse: <0.05mm
| Cutting seam: 0.05mm-0.1mm
| Size range: >5mm
| Machining accuracy: ±0.01mm
| Cutting, punching hours: 5mm / s
| Dimensional tolerance: ±0.003mm
| Minimum processing aperture: Φ0.1mm
Complaint
