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Silicon Wafer Slicing Machine 30W Laser Auto Solar Cell Cutting Machine

Silicon Wafer Slicing Machine 30W Laser Auto Solar Cell Cutting Machine

Min.Order: 1
Product origin: Qinhuangdao, Hebei, China
Infringement complaint: complaintComplaint
US$ 13000 ~ 15000

Description



silicon wafer slicing machine 30w laser auto solar cell cutting machine

Parameters

 Model XC-2000 Laser power 30W
 Scriber precision ≤±0.1mm Laser wavelength1064nm
 Scriber line width ≤40μm capacity 1800 pcs/hour (one cut)
 Maximum Scribing speed ≤600mm/s  solar cell 156*156-166*166mm 
 Power AC220V/50HZ/2.5KW  
 Cooling method Air-cooling
 

Characteristics

1. Advanced scribing technology
Adopt Raycus laser source, good quality laser beam, slim laser scribing line, more uniform solar cell cutting surface, small damage to solar cell, high accuracy cutting.
 
2. High efficiency
High laser scribing speed, producing capacity can reach to 1800 full cells/hour.
 
3. Accuracy positioning
Solar cell full automatic positioning, positioning accuracy ≤±0.1mm.
 
4. High automation level
Solar cell automatic loading and unloading, automatic positioning, automatic scribing.Stable performance, low failure rate, easy maintenance.

About production line

We can supply the customized complete production line. The engineer can adjust the layout and performance of the production line according to different requires of customers








 

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