Complaint
This product is made from organic silicone as the main raw material, add the thermal conductive filler of heat resistant ,heat conduction performance ,type made of heat conduction of organic silicon resin compounds, commonly known as the cooling paste, used in power amplifier, transistors, electron tubes, electronic components such as CPU heat conduction and heat dissipation, so as to ensure the electrical properties of electronic instruments, meters, etc.
| General Product Attribute Table | ||||||
| Project | Unit | GC-TG102 | GC-TG150 | GC-TG251 | GC-TG302 | Testing Standard |
| Color | - | white | Grey | white | Grey | - |
| Density | g/cm3 | 2.3±0.2 | 2.5±0.2 | 2.9±0.2 | 3.7 | ASTM D792 |
| Thermal Conductivity | W/m.k | 1±0.2 | 1.5±0.2 | 2.5±0.2 | 3±0.2 | ASTM D5470 |
| Thermal resistance | ºC*cm2/W | 0.24 | 0.2 | 0.23 | 0.08 | - |
| penetration | 0.1mm 25ºC | 300±20 | 310±20 | 310±20 | 285±20 | GB/T269 |
| Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |||
| Temperature Range | ºC | -40ºCto200ºC | EN344 | |||
| Storage life | month | 6(under seal) | - | |||
