High Precision Flip Chip Die Bonder dB100 Termway

Min.Order: 1
Product origin: Beijing, China
Infringement complaint: complaintComplaint
US$ 74800 ~ 114500

Description
semiautomaticc packaging submicron filp chip die bonder equipment 

  DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that the entire motion accuracy reaches the sub-micron level. It comes with a laser height measurement system, which can meet the needs of deep cavity substrate patch and eutectic welding. Optional module: nozzle heating module, nozzle pressure feedback system, UV dispensing and curing module, nitrogen protective gas module, substrate preheating module, process monitoring module, chip flip placing module.
 
  The placement accuracy of the system can reach 1um according to different configurations, and the nozzles can be manually replaced according to different sizes of chips. It is a necessary equipment for high-precision adhesive bonding of high-end medical equipment (core imaging module assembly), optical devices (laser LDpalladium bar assembly, VCSEL, PD, LENS, etc.), semiconductor chips (MEMS devices, radio frequency devices, microwave devices, and hybrid circuits). It is pretty suitable for the R&D and the needs of small batch and multi-variety production of research institutes, military units, universities and other research institutions, enterprise laboratories. The machine has high precision, stable performance and high cost performance. The operation is very convenient, especially suitable for high-precision chip assembly.
ModelDB100DB100S
Max. chip size≤20mm x 20mm(50*50mm optional)
Min. chip size0.2×0.2mm0.1×0.1mm
Mounting precision±3um 3δ±1um 3δ
Feeding mode2 inch waffle box*22 inch waffle box*2
Substrate size150×150mm110×110mm
Maximum nozzle pressureMaximum 200N, minimum 2NMaximum 200N, minimum 0.2N
X Y Z axis motion systemRoller screw + servo motorRoller screw + servo motor + grating ruler
X Y axis resolution0.1um0.1um
Z-axis resolution0.1um0.1um
R axis θ axis angleRotation control accuracy: 0.01°Rotation control accuracy: 0.01°
Air supplyIndustrial diaphragm pumpIndustrial diaphragm pump
Power3KW (not including eutectic table)3KW (not including eutectic table)
Power supply220V,50Hz220V,50Hz
Net weight150Kg160Kg
Dimensions800 * 750 * 630mm800 * 750 * 630mm

Standard configuration:
1. Placement system
2. Visual calibration system (systematic inspection and calibration of the precision of the mounted chip)
3. Laser ranging system
4. Dipping glue system
5. High-precision visual alignment system
6. Servo motion control system
 
Optional accessories:
1. Top nozzle heating module
2. Nozzle pressure feedback system
3. Dispensing and UV curing module
4. Nitrogen protection gas module
5. Substrate preheating module
6. Eutectic platform
7. Chip flip placing module
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