Integrated Circuit Ceramic Flat Package(SOP type and CQFP type) Black ceramic cryogenic glass packaging is a technology that uses low melting point glass and black alumina ceramics as materials to package and protect IC chips, small size, with good mechanical, electrical and chemical properties, and packaging process is simple, low price, high palmability. Suitable for mass production can be widely used in civil products, with broad market prospects and development spaceCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEMCQFP SOP IC Electronic Components OEM
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