Complaint
| Technical Capability | ||
| NO. | Item | Capability |
| 1 | Base Material | FR4,High TG FR4,Aluminum,Rogers ,CEM-3,CEM-1,etc. |
| 2 | Layer | 1~20 |
| 3 | Board Thickness | 0.3mm~3.5mm |
| 4 | Board Thickness Tolerance (>0.1mm) | ±0.1mm |
| 5 | Finished Outer Copper Thickness | H/H0Z-5/50Z |
| 6 | Finished Inner Copper Thickness | H/H0Z-4/40Z |
| 7 | Min Board Size | 8*8mm |
| 8 | Max Board Size | 650*610mm |
| 9 | Min Line Width/Space | 2.5/2.5mil |
| 10 | Min Hole Size | 0.2mm |
| 11 | Hole Tolerance | ±0.05mm |
| 12 | Solder Mask | Green,Red, Blue,White,Black,Yellow, etc. |
| 13 | Surface Finish | HASL,HASL lead free,OSP,Immersion Gold/ENIG,Gold-plating/Goldfinger,etc. |
| 14 | Min S/M Bridge | 3mil |
| 15 | Character Width (Min) | 0.15mm |
| 16 | Character Height (Min) | 0.85mm |
| 17 | Certificate | ISO,CQC,IATF,UL,ROHS |
| 18 | Value-added Service | Layout |
| 19 | Packing | Vacuum package |
| 20 | Application | Consumer electronics,Electric vehicle,Telecom devices, Industrial machine,Power supply, LCD modules,Instrument, Medical equipment,Education and development, etc. |
