N- (2-aminoethyl) -3-Aminopropytrimethoxy Silane ISO9001 Prosil 3128

Min.Order: 800
Product origin: Qingdao, Shandong, China
Infringement complaint: complaintComplaint
US$ 5

Description

Product Description
 
Chemical Name:N-(2-aminoethyl)-3-aminopropytrimethoxysilane
CAS#:1760-24-3
Structural Formula:NH2C2H4NHC3H6Si(OCH3)3


Typical Properties
 
Appearance:Colorless transparent  liquid
Color(Pt-Co):≤30
Molecular Weight:222.4
Specific Gravity (ρ20°C, g/cm3):1.010-1.030
Refractive Index (nD25):1.4405-1.4450
Boiling Point (°C): 146
Flash Point (°C):143
Purity (%):≥98.0


Applications
This product may be used as an additive, meeting the need of special primers in numerous bonding applications. It can display a good adhesion in the following system:

1.RTV Silicones and Hybrid Silane-Crosslinked Sealants
With single-double component silane-crosslinked sealant, it can improve the adhesion of many substrates, including glass, steel, aluminum and concrete. And it can dramatically enhance the adhesion to a wide array of plastics when used in combination with SPURSM Technology for silyl urethane polymers.

2.Polysulfide Sealants
When it's added to single-double component polysulfide sealants, it provides better adhesion to a variety of substrates, including glass, aluminum and steel. It disperses well and can obtain cohesive split rather than interfacial split between the sealant and the substrate. Furthermore, it can avoid using primers and it can enhance the adhesion strength between the coatings.

3.Plastic sealant
In plastic sealants treatment, silane HENGDA-M8253 (0.5 to 1.5 weight percent) as an adhesion promoter, a replacement for polyaminoamide, can improve bonding to metal substrates. In addition to increasing strength, the silane-modified plastic sealants have a better performance than systems those use polyaminoamide adhesion promoter. Silane KH-792-modified plastic systems have a very light color and the cured compound is bubble-free.

4.Additive in Phenolic and Epoxy Molding Compounds
As an additive in phenolic and epoxy molding compounds, reduces the water absorption of molded composites. So it can effectively improve wet electrical properties, particularly at low frequencies. High-temperature strength properties are also improved.
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