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Laboratory Automatic Ceramic Surface Grinding and Polishing Machine
Laboratory Automatic Ceramic Surface Grinding and Polishing Machine
Laboratory Automatic Ceramic Surface Grinding and Polishing Machine
Laboratory Automatic Ceramic Surface Grinding and Polishing Machine
Laboratory Automatic Ceramic Surface Grinding and Polishing Machine
Laboratory Automatic Ceramic Surface Grinding and Polishing Machine

Laboratory Automatic Ceramic Surface Grinding and Polishing Machine

Min.Order: 1
Product origin: Shenzhen, Guangdong, China
Infringement complaint: complaintComplaint
US$ 20000 ~ 60000

Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products
Special points:
1. Usually, the traditional way of polishing plate is to use electroplate wheel to trim, which is not ideal. The error will be tens of microns or even hundreds of microns, through the dressing machine, grinding disc flatness can reach ±0.002mm. The flatness of the workpiece after processing can reach ±0.0005mm (φ50mm).
2. A series of grinding machine parts are pressurized by pressing the weight block.
Working principle:
1. The grinding machine is a precision grinding and polishing equipment, the grinding and polishing materials are placed on the grinding disc, the grinding disc rotates against the clock, the correction wheel drives the workpiece to rotate, the gravity pressure on the workpiece, the workpiece and the grinding disc for relative running friction, to achieve the purpose of grinding and polishing.
2. The dressing mechanism of the grinding disc adopts the hydraulic suspension guide rail to move back and forth, and the diamond trimming knife trims the grinding surface of the grinding disc precisely to obtain the ideal plane effect.

APPLICATION
ProcessIndustry by SubstanceIndustry by Applicability
High
Speed
Grinding
& Thinning		Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone		Sealingsealing ring(liquid, oil, gas)
Semiconductorsubstrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
PlasticHard Plastic
Optics(flat)optical lens, optical reflector, holographic glass, HUD glass, screen glass
Gemstonejade, sapphire, agate, etc.
Othersgauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.


SPECIFICATION
Standard Specification
Machine ModelFD3803FD4603FD6103FD9104
Plate DiameterΦ380 mm / 15 inchesΦ460mm / 18 inchesΦ610mm / 24 inchesΦ910mm / 36 inches
Max. Workpiece Diameter
(without conditioning ring)		Φ180 mmΦ220 mmΦ270 mmΦ420 mm
Conditioning Ring DiameterΦ180 mmΦ220 mmΦ270 mmΦ420 mm
Number of Station3334
Plate Rotate Speed0-140 rpm0-140 rpm0-120 rpm0-90 rpm
Facing & Grooving Speed
(Not include in Polishing)		0-120 mm/m0-120 mm/m0-120 mm/m0-120 mm/m
Total Weight450 kg780 kg1000 kg1600 kg
Total Floor Space670×940 mm1030×730 mm1920×840 mm2100×1300 mm
      
Built-In Optional Kits 
GradeStandardAdvanced 
Slurry Recycle System-Integrated with PLC 
Dressing System-Integrated with PLC 
Station FixingMechanical FixturePneumatic Vacuum Fixing 
SpindleMechanicalPneumatic 
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. 


SAMPLE DEMONSTRATION (THINNING)


Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery and packing
Packing Instructions: Packing, 1 / wooden box.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries. 
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