Technical Capability | |
Item | Capability |
Base Material | FR4,High TG FR4,Aluminum,Rogers ,CEM-3,CEM-1,Lead free, etc. |
Layer | 1~20 |
Board Thickness | 0.3mm~3.5mm |
Board Thickness Tolerance (>0.1mm) | ±0.1mm |
Finished Outer Copper Thickness | H/H0Z-5/50Z |
Finished Inner Copper Thickness | H/H0Z-4/40Z |
Min Board Size | 8*8mm |
Max Board Size | 650*610mm |
Min Line Width/Space | 2.5/2.5mil |
Min Hole Size | 0.2mm |
Hole Tolerance | ±0.05mm |
Solder Mask | Green,Red, Blue,White,Black,Yellow, etc. |
Surface Finish | HASL, HASL lead free,OSP, Immersion gold/Tin/ Silver,ENIG,Gold-finger, etc. |
Min S/M Bridge | 3mil |
Character Width (Min) | 0.15mm |
Character Height (Min) | 0.85mm |
Certificate | ISO,CQC,IATF,UL,ROHS |
Value-added Service | Layout |
Packing | Vacuum package |
Application | Consumer electronics,Electric vehicle,Telecom devices, Industrial machine,Power supply, LCD modules,Instrument, Medical equipment,Education and development, etc. |
Delivery Time | ||
Type | Sample | Mass production |
2 Layers PCB | 2~3 Days | 7~8 Days |
4 Layers PCB | 5~6 Days | 8~10 Days |
6~8 Layers PCB | 5~6 Days | 8~10 Days |
Over 8 Layers PCB | 5~6 Days | 8~10 Days |
Special PCB | 14 Days | 14 Days |
*The above is the regular delivery time,can be adjusted as urgent needs. |