Technical Capability | ||
NO. | Item | Capability |
1 | PCB Base Material | FR4,High TG FR4,Aluminum,Rogers ,CEM-3,CEM-1,Lead free, etc. |
2 | Layer | 1~20 |
3 | Board Thickness | 0.3mm~3.5mm |
4 | Board Thickness Tolerance (>0.1mm) | ±0.1mm |
5 | Finished Outer Copper Thickness | H/H0Z-5/50Z |
6 | Finished Inner Copper Thickness | H/H0Z-4/40Z |
7 | Min Board Size | 8*8mm |
8 | Max Board Size | 650*610mm |
9 | Min Line Width/Space | 2.5/2.5mil |
10 | Min Hole Size | 0.2mm |
11 | Hole Tolerance | ±0.05mm |
12 | Solder Mask | Green,Red, Blue,White,Black,Yellow, etc. |
13 | Surface Finish | HASL, HASL lead free,OSP, Immersion gold/Tin/ Silver,ENIG,Gold-finger, etc. |
14 | Min S/M Bridge | 3mil |
15 | Character Width (Min) | 0.15mm |
16 | Character Height (Min) | 0.85mm |
17 | Certificate | ISO,CQC,IATF,UL,ROHS |
18 | Value-added Service | Layout |
19 | PCB Packing | Vacuum package |
20 | PCB Application | Consumer electronics,Electric vehicle,Telecom devices, Industrial machine,Power supply, LCD modules,Instrument, Medical equipment,Education and development, etc. |
Lead Time
PCB Type | Sample | Mass Production |
Double-sided PCB | 2~3 days | 7~8 days |
4 layers PCB | 5~6 days | 8~10 days |
6~8 layers PCB | 5~6 days | 8~10 days |
more than 8 layers PCB | 5~6 days | 8~10 days |
Special Printed Circuit Board | 14 days | 14 days |