The high-performance, multi-purpose UV laser cutting machine, and non-contract working platform is processed with high speed digital galvanometer and avoid the hidden damage caused by the stress processing of tool and molds; the use of 35nm UV laser with short wavelength, high energy density and small area that heat affected has eliminated the cooling water, cleaning water, cutting and dust accompanied with machanical processing and quickly destroy the molecularstructure of the material to achieve cold processing; it can identify DXF and GERBER files and eliminate molds to achieve rapid prototyping, cutting and drilling, so it is especially suitable for the processing of complex, sophisticated and difficult products; the processing of mobile phone camera module sub-board, fingerprint identification module cutting, TF cardtype memory card, FPC flexible circuit board high-speed laser cutting with the cutting thickness of 1mm has no burr with high precision and small range that heat affected; the control software based independently on the WINDOWS research and development, with all Chinese layout and a key fool operation, is simple and quick.
Designed with high-rigidity and high-safety structure, it is beautiful, durable and safe.
According to customer requirements, part of the machine can be customized.
Complaint
