| 1 | Layers | Single Sided,2 to 18 Layer |
| 2 | Board material type | FR4,CEM-1,CEM-3,ceramic substrate board,aluminum based board, high-Tg, Rogers and more |
| 3 | Compound material lamination | 4 to 6 layers |
| 4 | Maximum dimension | 610 x 1,100mm |
| 5 | Dimension tolerance | ±0.13mm |
| 6 | Board thickness coverage | 0.2 to 6.00mm |
| 7 | Board thickness tolerance | Board thickness≤1.0mm: +/-0.1mm |
| 1<Board thickness≤2.0mm: +/-10% |
| Board thickness>2.0mm: +/-8% |
| 8 | DK thickness | 0.076 to 6.00mm |
| 9 | Minimum line width | 0.10mm |
| 10 | Minimum line space | 0.10mm |
| 11 | Outer layer copper thickness | 8.75 to 175µm |
| 12 | Inner layer copper thickness | 17.5 to 175µm |
| 13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
| 14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
| 15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
| 16 | Hole position tolerance (mechanical drill) | 0.075mm |
| 17 | Laser drill hole size | 0.10mm |
| 18 | Board thickness and hole diameter ratio | 10:01 |
| 19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
| 20 | Minimum solder mask | Ø0.10mm |
| 21 | Minimum size of solder mask separation ring | 0.05mm |
| 22 | Solder mask oil plug hole diameter | 0.25 to 0.60mm |
| 23 | Impedance control tolerance | ±10% |
| 24 | Surface finish | Hot air level, ENIG, immersion silver, gold plating,immersion tin and gold finger |
| 25 | Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
| 26 | Acceptable file format | Gerber file,PROTEL series,PADS series,POWER PCB series,AutoCAD |
Complaint
