Chip Vacuum Soldering Machine to Decrease Soldering Void Rate

Applications:
Solder reflow with and without flux
Wafer bump and solder ball reflow
Flip chip
Encapsulation and sealing of housings
High Power LED module
Resistor paste firing
IGBT/DBC
Die attachment

RS Series vacuum reflow oven 

Function Introduction:
1.TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation of its small Vacuum Reflow Oven. 
RS series Vacuum Reflow Oven applicable to fluxless soldering without hollows at solder pot, available in various of gases, such as N2,Argon.
RS series Vacuum Reflow Oven is not only suitable for fluxless soldering, but also suitable for lead free solder paste or solder slice.
RS series Vacuum Reflow Oven is combined with software control system, easy to operate, you can use the software to control the machine and set the temperature profile as well as modify the programming to meet different solder requirement.

2.Industry application:RS series vacuum oven is the best choice for R&D, process research and development, material test, device packaging, and it is the best option for high-end development and production in industrial enterprises, research institute, colleges, universities aerospace.

Features:
1.Soldering under full vacuum.The vacuum value can be up 10-3mba.(10-6-mba optional)
2.Solderinging environment is with low activity flux.
3.Professional software control can achieve the perfect operating experience.
4.40 industry segments programmable temperature control system can help to set the perfect technology curve.
5.Temperature settings can be adjusted, which can set the welding materials technology curve that is much closer to perfect the process.
6.Water-cooling technology achieves the industry's fastest cooling effect (standard)
7.Online temperature measurement function.Accurate measurement of the weld zone temperature uniformity.Provide professional support for the process of adjustment.
8.Nitrogen or other inert gas can meet the special requirements of the welding process.
9.Highest temperature is 450 ºC (higher optional), which can meet all the requirements of the soldering process.
10.Allocate five of the industry's most comprehensive system security status monitoring and safety protection design (weldments over temperature protection, machine temperature safety protection, safe operation protection, welding cooling water protection, power protection)
Standard:

Packing List

One set computer
One set industry control computer
One set temperature control software
One set temperature controllor
One set pressure controllor
One set Inert gas or nitrogen gas control valve

Optional:
Corrosion resistant diaphragm pump, vacuum 10mba;
Rotary vane pump, used for vacuum of 10-3mba;
Eddy turn molecular pump system, used for vacuum of 10-6mba;
4.Hydrogen and hydrogen-type safety device
5.High Temperature Module (500 degree high temperature)

Model	RS110	RS160	RS220
Soldering Size	110mm*110mm	160*160mm	220*220mm
Furnace height	40mm(other Hights is optional)
Temperature Range	Up to 400
Connector	Serial 485 network / USB
Control Way	40 segments Temperature control + Vacuum Pressure Control
Temperature curve	can store several curves Temperature of 40 segments
Voltage	220V 25A	220V 28A	220V 36A
Rated Power	9KW	11KW	15KW
Actual Power	6KW(Don't choose a vacuum pump)	8KW(configurate  molecular pump)	11KW(Don't choose a vacuum pump)
	8KW(configurate  molecular pump)	10KW(configurate  molecular pump	13KW(configurate  molecular pump)
Dismension	450*450*1300mm	450*450*1300mm	500*450*1300mm
Wight	210KG	240KG	270KG
The maximum heating rate	120/min	120/min	120/min
The maximum cooling rate	80k/min	80k/min	80k/min
Cooling Way	Air cooling/water cooling	Air-cooled / water-cooled	Air-cooled / water-cooled

Vacuum soldering result:


Process

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