| PCB Item Manufacture Capacity |
| Layer Counts | 1L-40L | | Min Hole Size(mechanical) | 0.15mm |
| Base Material | NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic | | Min Hole Size(laser hole) | 0.1mm |
| FPC Material | Dupont,Taiflex,SYL,Thinflex | | Hole Size Tol (+/-) | PTH:+0.075mm; NPTH: +0.05mm |
| Material Thickness(mm) | T=0.1mm-3.2mm | | Hole Position Tol | ±0.075mm |
| Max board size(mm) | 1250mm x570mm | | HASL/LF HAL | 2.5um |
| Board Outline Tolerance | ±0.10mm | | Immersion Gold | Nickel 3-7um Au:1-5u" |
| Board Thickness | 0.4mm--3.2mm | | Surface Finish | HASL (LF), Gold Plating,Gold Finger,immersion Silver,immersion gold, OSP |
| Thickness Tolerance | ±10% | | Copper Weight | 0.5--6 OZ |
| Minimum line/space | 0.05mm/0.05mm | | Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Min Annular Ring | 0.12mm | | Silk screen | White, Black, Blue,Yellow |
| Quality Criterion | IPC-A-600J,IPC-6012E,IPC-4101C,IPC-SM-840,IPC-TM-650 UL796 | | Certificate | IATF16949;2016 ISO14000 |
| | | | | |
| PCBA Item Manufacture Capacity |
| Items | | Capacity |
| PCB Assembly Min. IC Pitch | | 0.20mm(8mil) |
| PCB Assembly Foot Pin | | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
| PCB Assembly Min. Chip Placement | | 201 |
| PCB Assembly Max. PCB Size | | 410mm x 600mm(16.2" x 23.6") |
| PCB Assembly Maximum BGA Size | | 74mm x 74mm(2.9" x 2.9") |
| PCB Assembly BGA Ball Pitch | | 0.2mm/8mil |
| PCB Assembly BGA Ball Diameter | | 0.03mm/1.2mil |
| PCB Assembly Method | | SMT, DIP, AI,MI |
| PCB Assembly Certification | | ISO14000, IATF16949 |
Complaint
